PSX800
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Assembly System Plasma Dicer • Ability to dice very thin wafers without causing damage • Chips with excellent fracture toughness •Suitable for a wide range of applications * For details, please refer to the specifications.

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Our Solutions, Your Value Capable of dicing very thin wafers without damage Conventional wafer dicing systems using blade dicing technology are disadvantageous in that chipping, cracks or the like are generated when handling very thin wafers or wafers with a low mechanical strength, causing PSX800, on the other hand, made it possible to dice silicon wafers without causing damage on them by employing plasma etching technology and using no conventional machining process. Plasma dicing is characterized in that no wafer is chipped, a reduced dicing width of approx. 1/3 of that with blade-dicing...

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