Lasers for Materials Processing
1 / 16Páginas

{{requestButtons}}

Excertos do catálogo

Lasers for Materials Processing - 1

Superior Reliability & Performance

Abrir o catálogo na página 1
Lasers for Materials Processing - 2

COHERENT The Right Laser Solution for Your Application. Materials processing experts face a wide range of choices in determining the right laser for their production needs. Nanosecond or picosecond; ultraviolet, green or infrared; CO2, DPSS or fiber lasers. Choosing between these lasers can be a challenge.

Abrir o catálogo na página 2
Lasers for Materials Processing - 3

At Coherent, we know there is no one best laser for every application. With more than 50 years of laser expertise, Coherent provides the broadest selection of laser technologies available from any company, enabling us to deliver the optimum solution for your application, no matter what its requirements. With a global network of applications and process development engineers, we work with you to determine the right laser for your process needs. And, our worldwide service and technical support infrastructure will ensure optimum laser performance on your production line.

Abrir o catálogo na página 3
Lasers for Materials Processing - 4

Laser Materials Processing Applications Display Manufacturing Annealing is widely used to improve the characteristics of ma­ erials, t in particular thin films, with applications extending from wafer scale to large substrates. Laser annealing can activate dopants for advanced CMOS circuitry, sensors, IGBT, 3-D integration and more. Excimer lasers are widely adopted for the crystallization of amor­ hous silicon p films used to form the polysilicon layers that provide the electrical functionality for high resolution displays. Laser crystallized polysilicon also provides the stability required...

Abrir o catálogo na página 4
Lasers for Materials Processing - 5

Laser cutting is a mature industrial process with high flexibility, noncontact and stress free processes that produce finished parts direct from the tool. Laser cutting is a very precise process, with excellent dimensional stability, very small heat affected zone, and narrow cut kerfs. Various technologies are used in this process depending on the type of material to be cut. Plastics, ceramics, fiber-reinforced materials, and organics such as leather, fabric, paper, wood and others are processed ideally with Diamond CO2 lasers. Its wavelength of 10.6 μm offers optimal absorption to cut by...

Abrir o catálogo na página 5
Lasers for Materials Processing - 6

Heat Treating: In laser heat treating or case hardening, a spatially well defined beam from a High Power Direct-Diode Laser is used to illuminate a work piece. The light causes rapid heating that is highly localized to the illuminated area and does not penetrate very deep into the bulk material. The bulk heat capacity of the material typically acts as a heat sink for the extraction of heat from the surface therefore enabling self-quenching. Coherent direct-diode HighLight D-Series and fiber laser HighLight FL-Series lasers enable rapid processing, precise localized control over case...

Abrir o catálogo na página 6
Lasers for Materials Processing - 7

Rapid Prototyping: Rapid Prototyping is used in applications where design prottypes or a low volume of complex parts are required to be fabricated quickly without the need of complex tooling. The process is differentiated between Stereolithography (SLA) using an epoxy polymer and Selective Laser Sintering (SLM) using metal or ceramic powder. In both the SLA and SLM processes, a 3-D CAD model is sliced into many layers like a stack of cards then transferred to the SLA or SLM tool. The laser beam is steered by a galvanometric scanner head and builds up the part layer by layer. After each...

Abrir o catálogo na página 7
Lasers for Materials Processing - 8

Laser Products for Materials Processing Helios: ps performance, ns cost AVIA: diode-pumped, solid-state, q-switched lasers MATRIX DPSS: high performance marking Diode-Pumped Solid-State Lasers: MATRIX is a family of diode-pumped, solid-state (DPSS), Q-switch lasers, available in 1064 nm, 532 nm and 355 nm wavelengths. MATRIX is optimized for cost-sensitive applications requiring high throughput and that do not allow compromises in process quality. The lasers are manufactured utilizing Coherent’s PermAlign technology which guarantees best optical alignment and stability. For pumping,...

Abrir o catálogo na página 8
Lasers for Materials Processing - 9

short wavelength that is directly generated without frequency conversion, the lasers high energy per pulse e.g. up to 4 Joules, and their high power up to 2.4 kW in the interesting UV wavelength range. Fully automated operation with precision control of the output energy and power is a unique feature of Coherent’s entire Excimer line. Full metal ceramic construction of the laser tube, solid-state pulser, advanced gas management and fully integrated data logging are some of the other key features which are the basis for the ease-of-use and high longevity of Excimer lasers. Applications of...

Abrir o catálogo na página 9
Lasers for Materials Processing - 10

Coherent’s Diamond E-Series and J-Series lasers are sealed, pulsed CO2 systems with a built-in RF power supply, which increases reliability and simplifies integration. A full suite of on-board diagnostics enables proactive maintenance to minimize downtime and reduce the overall cost of ownership. These lasers deliver a combination of high peak power, and fast rise-and-fall times at average powers of 100’s of Watts. Their excellent beam quality and high pulse frequency make the Diamond E-Series and J-Series are ideal for a wide range of materials processing applications. Diamond C-Series and...

Abrir o catálogo na página 10
Lasers for Materials Processing - 11

Direct-Diode Lasers: Coherent’s HighLight D-Series of direct-diode lasers deliver multiple kWs of power and an increased range of “smart” output beam shapes, making it the ideal source for heat treating, cladding, and welding – all at faster speeds, greater deposition rates and larger areas. Free-space beam delivery preserves the inherent brightness of the diode laser source and enables the use of an optical system with a large working distance. In conjunction with large tophat beam shapes, it increases production speeds to new benchmark levels, allowing larger areas to be processed in a...

Abrir o catálogo na página 11
Lasers for Materials Processing - 12

Ultrashort Pulse Lasers: The Rapid family of industrial picosecond lasers integrate a oscillator with one or more amplifier stages within a rugged, compact laser head. And, because this robust configuration enables an average power of up to 100W, Rapid series lasers can deliver high material removal rates. Rapid series lasers also support “Burst Mode” operation, proven to dramatically increase the ablation rate when processing materials having free electrons, such as steel, and tungsten carbide. Rapid and HyperRapid also come with a choice of IR/Green/UV wavelengths. Rapid: picosecond...

Abrir o catálogo na página 12

Todos os catálogos e folhetos técnicos COHERENT

  1. ExactCut 430

    4 Páginas

  2. INNOVA 70C

    4 Páginas

  3. ExciStar

    3 Páginas

  4. Axon

    5 Páginas

  5. Astrella

    3 Páginas

  6. Innova 90C FreD

    2 Páginas

  7. Innova® Sabre

    5 Páginas

  8. AVIA LX

    4 Páginas

  9. ULN

    3 Páginas

  10. Monaco 1035

    4 Páginas

  11. Mira HP

    2 Páginas

  12. Levante IR fs OPO

    4 Páginas

  13. Vitara

    6 Páginas

  14. EASYJEWEL

    2 Páginas

  15. META 10C

    3 Páginas

  16. FLARE NX

    4 Páginas

  17. META 2C

    3 Páginas

  18. X-LASE SERIES

    3 Páginas

  19. HighLight FL-ARM

    4 Páginas

  20. O-LASE SERIES

    4 Páginas

  21. HyperRapid NX

    4 Páginas

  22. DC Series

    2 Páginas

  23. UMB 1430-1470nm

    3 Páginas

  24. UMB 1060nm

    3 Páginas

  25. UMB 965-985nm

    3 Páginas

  26. UMC 780-830nm

    4 Páginas

  27. NUV-320-K1

    1 Páginas

  28. Astrella

    6 Páginas

  29. OBIS LG 355-20

    3 Páginas

  30. Compass 115M

    2 Páginas

  31. Innova 90C

    4 Páginas

  32. MBD-200

    2 Páginas

  33. MBR-01 Ring Laser

    2 Páginas

  34. MicroLas

    6 Páginas

  35. LEAP

    2 Páginas

  36. CrystaLas

    6 Páginas

  37. LPXpro Series

    2 Páginas

  38. ExciStar XS

    2 Páginas

  39. Azure

    4 Páginas

  40. Daytona-HE 355

    3 Páginas

  41. Staccato

    2 Páginas

  42. FLARE

    2 Páginas

  43. HELIOS

    3 Páginas

  44. Coherent BioRay

    5 Páginas

  45. OBIS

    8 Páginas

  46. Talisker Brochure

    4 Páginas

  47. Talisker_brochure

    4 Páginas

  48. Product catalogue

    48 Páginas