Empowering Tomorrow's AI Computing MXM-R1 RK3588 MXM Core Module User Manual

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3. MXM Board Outlines: Figure 3.1 shows the board outlines (top side view) for Type B MXM modules. An additional system keep-out of 0.5mm[0.020] per side is allowed on the PCB to accommodate whatever means of production panelization is required. This additional clearance is above and beyond the dimensional limits presented here. The location of of these features is not specified or controlled.

Table 3.1: Board Outline Dimensions

All MXM version 3.1 modules have 6 holes. Two are used to secure the board to the system and the other four to fasten the thermal solution to the module.

Table 4.1: Mounting Holes Dimensions

6. MXM Connector: Figure 6.1 MXM Connector (Card Top) Figure 6.2 MXM Connector (Card Bottom)

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1. Fix the board onto heat sink, the heat sink external diameter is 4mm, M2 screw bolt. 2. The weight of heat sink should be supported and fastened by the case. 3. RAM and MOS should be added thermal pad.

深圳智锐通科技有限公司 Shenzhen ZRT Technology Co., Ltd Shenzhen ZRT Technology Co., Ltd Email: [email protected] Tel.: +86-400-838-6869 +86-153-3876-2616 Website: www.zrt-tech.com Address: Room 2105-2106, Building A, Fenghuang Zhigu, No. 50, Tiezai Road, Xixiang Street, Bao’an District, 518100, Shenzhen Version 2024. All specifications are subject to change without prior notice. This information is for reference only, and the company reserves t