SSM 4A / SSM 9
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SSM 4A / SSM 9 - 1

SSM 4A / SSM 9 Repair of through hole parts

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SSM 4A / SSM 9 - 2

Swiss Engineering SSM 4A / SSM9 The SSM machines are used for selective soldering and desoldering of multilead, trough-hole technology components. Due to the programmable parameters precise and repeatable results can be achieved, user-independent. MAIN FEATURES • Flexible solutions for standard or irregular shaped components • Repeatable soldering results due to defined process parameters as soldering temperature, process time, wave height, ramp up and ramp down or regarding the SSM 9, up to 10 programmable parameters • Easy height adjustment of the printed circuit board over the flow well...

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SSM 4A / SSM 9 - 3

APPLICATION RANGE Repairs Damaged components can be replaced. Prototyping Prototypes can be equiped and soldered in an efficient way with the SSM 4 and SSM 9. Retrofits • Components which are missing at production time • On the soldering side components have to be placed • A SMD equipped board has to be extended by single wired components Soldering When equiping boards with only few components the use of the solderingand desoldering machines SSM 4 or SSM 9 is in most cases the simplest and most economical way. Saves time The system's ergonomic design speeds up and simplifies your work and...

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SSM 4A / SSM 9 - 4

Swiss Engineering SSM 4A The SSM 4A is used for selective soldering and desoldering of multipolar trough hole components (THT). Due to defined process parameters repeatable results can be achieved. Max. board size Pumping system Heat up time Cycle duration Air pressure Solder tenperature Max. power consumption Power requirements Dimensions (W x D x H) Solder content Weight (without solder) 600 x 600 mm Solder pump Approx. 30 min 0 - 60 s 1 - 8 bar 200 °C - 300 °C 2500 Watt 220 - 230 Volt, 50 Hz 440 x 800 x 360 mm Approx. 16 kg 47 kg

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SSM 4A / SSM 9 - 5

SSM 9 The SSM 9 is used for selective soldering and desoldering of multipolar trough hole components. Due to the programmable parameters precise and repeatable results can be achieved, user-independent Max. board size Pumping system Heat up time Cycle duration Air pressure Solder tenperature Max. power consumption Power requirements Dimensions (W x D x H) Solder content Weight (without solder) 840 x 600 mm Solder pump Approx. 30 min 0 - 60 s 1 - 8 bar 235 °C - 400 °C 2500 Watt 220 - 230 Volt, 50 Hz 440 x 800 x 360 mm Approx. 16 kg 75 kg REPAIR OF TROUGH HOLE PARTS

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