SSM 4A / SSM 9
SSM 4A / SSM 9
The document provides technical specifications and features of the SSM 4A and SSM 9 machines, which are used for selective soldering and desoldering of through-hole technology components. These machines are designed to deliver precise and repeatable results through programmable parameters.
Market Requirements
- Enhanced Effectiveness: Fast positioning with air nozzle, simultaneous soldering and desoldering, and reliable blow-out of solder holes.
- Enhanced Quality: Precise soldering parameters, reproducible results, protection against mechanical stress, and flexible solutions for various component shapes.
Main Features
- Swiss engineering with up to ten programmable parameters for precise soldering.
- Capability to handle complex geometries and dense mixed technology boards.
- Optional preheater module PH 4 for lead-free applications.
Application Range
The machines are suitable for repairs, prototyping, retrofits, and soldering tasks, especially on multilayer boards and complex components.
Technical Data
- SSM 4A: Max board size 600 x 600 mm, solder temperature 200°C - 300°C, power consumption 2500 Watt.
- SSM 9: Max board size 840 x 600 mm, solder temperature 235°C - 400°C, power consumption 2500 Watt.
Contact Information
For further inquiries, contact Zevac at Vogelherdstrasse 4, 4500 Solothurn, Switzerland, or via email at [email protected].
Catalog excerpts
SSM 4A / SSM 9 Repair of through hole parts
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Swiss Engineering SSM 4A / SSM9 The SSM machines are used for selective soldering and desoldering of multilead, trough-hole technology components. Due to the programmable parameters precise and repeatable results can be achieved, user-independent. MAIN FEATURES • Flexible solutions for standard or irregular shaped components • Repeatable soldering results due to defined process parameters as soldering temperature, process time, wave height, ramp up and ramp down or regarding the SSM 9, up to 10 programmable parameters • Easy height adjustment of the printed circuit board over the flow well •...
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APPLICATION RANGE Repairs Damaged components can be replaced. Prototyping Prototypes can be equiped and soldered in an efficient way with the SSM 4 and SSM 9. Retrofits • Components which are missing at production time • On the soldering side components have to be placed • A SMD equipped board has to be extended by single wired components Soldering When equiping boards with only few components the use of the solderingand desoldering machines SSM 4 or SSM 9 is in most cases the simplest and most economical way. Saves time The system's ergonomic design speeds up and simplifies your work and generates...
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Swiss Engineering SSM 4A The SSM 4A is used for selective soldering and desoldering of multipolar trough hole components (THT). Due to defined process parameters repeatable results can be achieved. Max. board size Pumping system Heat up time Cycle duration Air pressure Solder tenperature Max. power consumption Power requirements Dimensions (W x D x H) Solder content Weight (without solder) 600 x 600 mm Solder pump Approx. 30 min 0 - 60 s 1 - 8 bar 200 °C - 300 °C 2500 Watt 220 - 230 Volt, 50 Hz 440 x 800 x 360 mm Approx. 16 kg 47 kg
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SSM 9 The SSM 9 is used for selective soldering and desoldering of multipolar trough hole components. Due to the programmable parameters precise and repeatable results can be achieved, user-independent Max. board size Pumping system Heat up time Cycle duration Air pressure Solder tenperature Max. power consumption Power requirements Dimensions (W x D x H) Solder content Weight (without solder) 840 x 600 mm Solder pump Approx. 30 min 0 - 60 s 1 - 8 bar 235 °C - 400 °C 2500 Watt 220 - 230 Volt, 50 Hz 440 x 800 x 360 mm Approx. 16 kg 75 kg REPAIR OF TROUGH HOLE PARTS
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