ONYX MILLING Repair of SMD circuit boards

ONYX MILLING Once soldered SMD components normally can only be removed from the printed circuit board or substrate by using de-soldering processes applying massive heat to the device. With the novel ONYX Milling machine, SMD components can be milled off the substrate very precisely. A clean surface results, perfect for the placement and soldering of new components. MAIN FEATURES • High frequency precision spindle up to 80'000 min-1 • Entire process without any tool change • Different tools with e.g. diamond coating • Automatic tool calibration in X / Y and Z direction • X and Y linear motors...

APPLICATION RANGE • Components with «underfill» can be removed precisely without any impact of heat • Connectors and metal BGA can be detached easily • Painted printed circuit boards can be edited • Component salvage by milling the printed circuit board • Minor SMD parts are removable fast and precisely • Printed circuit boards, master cards or substrates can be prepared for the placement of new components • A clean surface results, perfect for the placement and soldering of new components • Optionally the ONYX Milling machine can also be expanded to a dispensing machine to apply new solder ONYX...