ONYX MILLING
ONYX MILLING
The ONYX Milling machine offers a novel approach to the repair of SMD circuit boards by allowing precise removal of components without the need for traditional de-soldering processes that apply massive heat.
Precise Removal of Components
The machine uses a milling process to remove SMD components, resulting in a clean surface ideal for new component placement and soldering. The process includes vacuuming dust and particles, and mechanically removing solder to a precise height. It can also handle "underfill" material removal. The substrate remains unharmed, ensuring excellent conditions for subsequent soldering.
Main Features
- High-frequency precision spindle up to 80,000 min-1
- Entire process without tool change
- Various tools available, including diamond-coated options
- Automatic tool calibration in X, Y, and Z directions
- X and Y linear motors for precision
- Integrated exhaust device
- Down-looking image data processing
- Circuit board holder
- ONYX Milling application software
Application Range
- Removal of components with "underfill" without heat impact
- Detachment of connectors and metal BGA
- Editing of painted printed circuit boards
- Salvage of components by milling the board
- Fast and precise removal of minor SMD parts
- Preparation of boards for new component placement
- Optional expansion to a dispensing machine for new solder application
Contact Information
Swiss Engineering
Vogelherdstrasse 4, 4500 Solothurn, Switzerland
Email: [email protected]
Tel: +41 32 626 20 80
Fax: +41 32 626 20 90
Catalog excerpts
ONYX MILLING Repair of SMD circuit boards
Open the catalog to page 1
ONYX MILLING Once soldered SMD components normally can only be removed from the printed circuit board or substrate by using de-soldering processes applying massive heat to the device. With the novel ONYX Milling machine, SMD components can be milled off the substrate very precisely. A clean surface results, perfect for the placement and soldering of new components. MAIN FEATURES • High frequency precision spindle up to 80'000 min-1 • Entire process without any tool change • Different tools with e.g. diamond coating • Automatic tool calibration in X / Y and Z direction • X and Y linear motors...
Open the catalog to page 2
APPLICATION RANGE • Components with «underfill» can be removed precisely without any impact of heat • Connectors and metal BGA can be detached easily • Painted printed circuit boards can be edited • Component salvage by milling the printed circuit board • Minor SMD parts are removable fast and precisely • Printed circuit boards, master cards or substrates can be prepared for the placement of new components • A clean surface results, perfect for the placement and soldering of new components • Optionally the ONYX Milling machine can also be expanded to a dispensing machine to apply new solder ONYX...
Open the catalog to page 3
