TS Solutions
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TEST SOLUTIONS FULL PRODUCT LINE

ABOUT YAMAICHI ELECTRONICS / ÜBER YAMAICHI ELECTRONICS YAMAICHI ELECTRONICS FACTS & FIGURES YAMAICHI ELECTRONICS ZAHLEN & FAKTEN Headquarters, Tokyo: 1956 European Headquarter, Aschheim near Munich: 1986 Konzernsitz, Tokyo: 1956 Europäische Zentrale, Aschheim bei München:1986 über 2.100 weltweit, 285 in Europa ISO 14001:2015 (production in Frankfurt/Oder) Locations: ISO/TS 16949 (selected production sites) ISO/TS 16949 (ausgewählte Produktionsstandorte) Worldwide 7 production sites, 6 design centers, 13 sales locations weltweit 7 Produktionsstandorte, 6 Design-Zentren, 13 Vertriebszentren...

INTERFACE SOLUTIONS Automotive-Test Adapter Qseven-Test Adapter ComExpress -Test Adapter DIMM / SODIMM -Test Adapter Smarc Test Adapter CONTACTING - SEMICONDUCTOR ZIP (Zig-Zag Inline Package) Applicable dimensions: 0.4 to 0.5mm pitch .. 0.635 and 0.65mm pitch 0.8 to 1.0mm pitch. ... LCC (Non-Leaded Devices) 1.016 and 1.27mm pitch. TH clamshell socket for LCC. .

TABLE OF CONTENTS CONTACTING - SEMICONDUCTOR QFN (Quad Flat Non-Leaded) Test Contactor - SERIES Y-RED Modular Socket Adapters. PCB SOLUTIONS PCB SOLUTIONS CONTACTING - MODULES SIMM (Single Inline Memory Module) Card Edge Connectors CONTACTING - MODULES PCB SOLUTIONS CONTACTING - SEMICONDUCTOR INTERFACE SOLUTIONS

INTERFACE SOLUTIONS An adapter board acts as a mechanical and electrical interface between the tester (ATE) and the device under test (DUT). The range of such an adaption can vary from very simple to quite complex where it has well-defined physical dimensions and it must fit perfectly into the tester environment. A properly designed adapter board is electronically “invisible”, and does not introduce any distortion or delay to the DUT signals. The adapter board should be able to support all the tests executed on the tester and be flexible enough to support future testing. Yamaichi...

With sophisticated and customized designs Yamaichi Electronics provides test adapter systems for high speed signal test of industry and automotive computer-on-modules. Superior and reliable contact design ensures high speed signal integrity. Our product range includes vertical and horizontal test adapters for burn-in, functional testing and flashing. The applicable industry module standards are SMARC, COM Express, Qseven, SO-DIMM and DIMM. Yamaichi Electronics have also developed solutions for the entire manufacturing process with our Unique Test and Flash Adapter The advantages of the test...

QSEVEN TEST ADAPTER Operating Temp. : Pitch: Mating Cycles: -up to +85°C 0.5mm Up to 50,000 times (mechanical contact cycles at room temperature depending on customer environmental conditions) Impedance Controlled Layerstack architecture according to Qseven AUTOMOTIVE & QSEVEN MATERIALS AND FINISH Housing: Peek / Anodized Aluminium Contacts: Beryllium Copper / Gold Plated over Nickel Flex/Rigid: Epoxy/Polymid, Multilayer Contact Pad Surface: Hard Gold FEATURES • Performance controlled system acc. to Qseven • Compatible to MXM Connector / Board Edge Connector 230 Pins (BEC) •...

ComExpress TEST ADAPTER PART NUMBER Operating Temp. : up to +85°C Mating Cycles: 50,000 (expected) (mechanical contact cycles at room temperature depending on customer environmental conditions) comexpress MATERIALS AND FINISH Housing: Peek / Anodized Aluminium Contacts: Beryllium Copper / Gold Plated over Nickel Flex/Rigid: Epoxy/Polymid, Multilayer Contact Pad Surface: Hard Gold FEATURES • Reliable Probe Pin Technology • Compatible to ComExpress standards • Flexible in module size • In-line volume test • Volume test ready • Other Computer-on-Module Test Systems on...

SPECIFICATIONS Operating Temp. : up to +85°C Pitch: > 0.5mm Mating Cycles: 50,000 (expected) (mechanical contact cycles at room temperature depending on customer environmental conditions) Module Type: DIMM or SODIMM Design No.(internal) Housing: Peek / Anodized Aluminium Contacts: Beryllium Copper / Gold Plated over Nickel Flex/Rigid: Epoxy/Polymid, Multilayer Contact Pad Surface: Hard Gold FEATURES • Performance contolled system • Compatible to DIMM / SODIMM standards • In-line volume test • Volume test ready • Serial number SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO...

SMARC TEST ADAPTER YAMAICHI ELECTRONICS SPECIFICATIONS Operating temp. : Pitch: Mating Cycles: PART NUMBER up to +85°C 0.5mm 50,000 (expected) (mechanical contact cycles at room temperature depending on customer environmental conditions) Impedance Controlled layerstack architecture according customer requirements SMARC - *** ▲ A Application: - Test adapter - Flash (Programming) Housing: Peek / Anodized Aluminium Contacts: Beryllium Copper / Gold Plated over Nickel Flex/Rigid: Epoxy/Polymid, Multilayer Contact Pad Surface: Hard Gold • Performance controlled system acc. to...

SPECIFICATIONS Contact Resistance: Contact Force: Operating Temp. Range: Mating Cycles: PART NUMBER <50mΩ ~30g (typical) -20°C to +85°C >10,000 times Series Pitch Size MATERIALS AND FINISH Plating: Gold over Nickel • Clip type socket (customised) • Proven stamped contact • Outstanding contact reliability with wiping action • Ultra low pitch capability (0.3mm staggered) • Minimized pad damage • Elevator FPC stage (protect FPC and contact damage) • Testing Jig for modules with FPC / FFC BASE SOCKET FOR ALL OTHER CONNECTORS OUTLINE SOCKET DIMENSIONS SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO...

iYAMAICHIELECTRONICS SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING SEMICONDUCTORS

SPECIFICATIONS Contact Resistance: Contact Force: Operating Temp. Range: Mating Cycles: PART NUMBER <50mΩ 25gf (typical) -40°C to +125°C >50,000 times MATERIALS AND FINISH Housing: Contacts: Plating: PEEK / Anodized Aluminium Beryllium Copper (BeCu) Gold over Nickel Pitch Size Type of Flex Design No. (internal) FEATURES • Customised socket • Proven fine pitch probe pin • Outstanding contact reliability • Ultra low pitch capability (>0.3mm staggered) • Minimised DUT pad damage • Integrated floating base for flex and pin protection PUSH LEVER TYPE SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO...