Introduction
DPC (Direct Plated Copper) is a cutting-edge technology in the ceramic substrate PCB field. It utilizes magnetron sputtering to deposit a metal layer (Ti/Cu target) on the ceramic substrate surface, achieving a copper layer thickness ranging from 10 μm to 130 μm. Circuit patterns are formed through photolithography, and electroplating fills gaps to thicken the metal circuit layer. Surface treatment enhances solderability and oxidation resistance. The process concludes with dry film stripping and seed layer etching.

Features

• High thermal stability and excellent conductivity
• Superior mechanical stability and adhesion
• Suitable for high operating temperatures
• Excellent electrical insulation
• Good thermal diffusivity

Applications

• High-power LEDs
• Solar concentrator cells
• Power semiconductor packages (e.g., IGBT packages)
• Laser systems
• Microwave devices
• RF applications
• Power management electronic components in hybrid and electric vehicles
• Automotive motor control system sensors

Ceramic Material Properties
Comparison of properties between Alumina and AlN:

• Density: Alumina ≥3.7 g/cm³, AlN ≥3.3 g/cm³
• Thermal conductivity: Alumina >24 W/m·K, AlN >170 W/m·K
• Thermal expansion coefficient: Alumina 6.5~7.5 x10^-6/K, AlN 4.6 x10^-6/K
• Bending strength: Both >350 MPa
• Dielectric loss (1MHz): Alumina 3 x10^-4, AlN 3.8 x10^-4
• Dielectric constant (1MHz): Alumina 9.8, AlN 9
• Insulation breakdown strength: Alumina 14.5 Kv/m, AlN 17 Kv/m
• Volume resistivity: Both >10¹⁴ Ω·cm
• Young's modulus: Alumina 340 GPa, AlN 320 GPa

Manufacturing Capabilities

• Substrate materials: Al2O3, AlN
• Ceramic substrate thickness: 0.38-1.0 mm
• Copper layer thickness varies with substrate thickness
• Silver layer thickness: ≥0.4 μm
• Surface treatment: NiAu/NiPdAu with specific thicknesses for each layer