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Xiamen Innovacera Advanced Materials Co., Ltd
Active Metal Brazing Introduction

Active Metal Brazing Introduction

Product catalog summary

Introduction
Active Metal Brazing (AMB) is a technique used to bond ceramics and metals through a chemical reaction involving active elements like Titanium (Ti) and Zirconium (Zr) in the filler metal. This process forms a reaction layer that can be wetted by liquid filler metal, resulting in strong and reliable bonds.

Advantages

High bonding strength and reliability due to chemical reactions at high temperatures.
Capability to have varying copper thickness on a single plate.
Environmentally friendly process.
Strong resistance to both cold and heat.
Facilitates easy full automation, enhancing production efficiency and reducing costs.
Suitable copper thickness (0.1-0.5mm) for high power device packaging.

Properties
Si3N4

Composition: 96% SiN
Thickness: 0.2 to 1.5 mm
Density: 3.2±0.25 g/cm³
Thermal Conductivity: 85+ W/m·k
Flexural Strength: 700-800 MPa
Dielectric Constant: 8
Dielectric Loss: 0.001
Dielectric Strength: 20 KV/mm
Volume Resistivity: 10¹⁴ Ω/cm

ALN

Composition: 96% ALN
Thickness: 0.25 to 0.635 mm
Density: 3.3 g/cm³
Thermal Conductivity: 170+ W/m·k
Flexural Strength: 350 MPa
Dielectric Constant: 9
Dielectric Loss: 0.0005
Dielectric Strength: 20 KV/mm
Volume Resistivity: 10¹⁴ Ω/cm

Copper

Material: Oxygen-free Copper
Purity: 99.99%
Hardness: 60-110 HV
Conductivity: 58.6 MS/m
Thickness: 0.2 to 1.2 mm

AMB Substrate

Largest Size: 190*140 mm
Line Spacing: ≥0.5 mm
Line Width: Customized
Peel Strength of Copper Layer: ＞10 N/mm
Solderability: ＞95%
Delivery Method: Small Pieces or Panel
Surface States: CU/AU/AG

Applications
The document does not specify applications, but the properties and advantages suggest suitability for high power device packaging and environments requiring strong thermal and mechanical resistance.

Catalog excerpts

Active Metal Brazing Introduction

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Metal Brazing) Introduction It is a method to realize the bonding of ceramic and metal by reacting a small amount of active elements Ti and Zr in filler metal with ceramics to form a reaction layer which can be wetted by liquid filler metal. • The combination is achieved by chemical reaction between ceramic and active metal solder paste at high temperature, so its bonding strength is higher and reliability is better; • Could have different thickness of copper on one plate; • Environmental frindly; • Strong cold and heat resistance; • Easy full automation, production efficiency high, low production...

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XIAMEN INNOVACERA ADVANCED MATERIALS CO.,LTD Block A, 6/F, No.588 Jiahe Road, Torch High-tech Industrial District, Xiamen, China View Catalogue

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