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Midas 320A Dual Spindle SiC Grinder

Midas 320A Dual Spindle SiC Grinder
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Midas 320A Dual Spindle SiC Grinder

Product catalog summary

Introduction
The document discusses the capabilities of the Midas 320A Dual Spindle SiC Grinder by Weldon Solutions, emphasizing its impact on enhancing manufacturing operations, efficiency, and profitability.

Specifications and Features
The Midas 320A is designed for silicon wafer technology, utilizing an angular approach diamond grinding wheel for grinding the outer diameter (OD) and end face. A sub-spindle with a straight approach diamond wheel is used to generate flats at specific C-axis coordinates relative to the crystal's grain structure. This design increases productivity, reduces production costs, and ensures high-quality output.

System Components
The system includes components from various suppliers: ATS collet chuck, Setco sub-spindle, Encyclon coolant filtration system, Renishaw probe, GII electric dresser, Dittel acoustic emissions, Koolant Koolers tri-circuit spindle, linear motor, coolant chiller, SBS automatic wheel balancer, Heidenhain linear and rotary glass scales, and FANUC 32i BT CNC control.

Additional Capabilities
Weldon Solutions offers a range of CNC OD, ID, and combination grinders. As a FANUC Robotics integrator, they can also provide solutions for machine tending, material removal, material handling, and packaging/palletizing needs.

Benefits
The unique multi-spindle design of the Midas 320A allows for OD, flat, and face grinding in a single operation, significantly reducing silicon wafer production costs.

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Catalog excerpts

Midas 320A Dual Spindle SiC Grinder-1

Midas 320A Dual Spindle SiC Grinder A leader in Silicon Wafer technology has once again come to Weldon for solutions to their unique SiC grinding requirements. In this application, an angular approach diamond grinding wheel is used to grind the OD & end face. In the same operation, a sub-spindle with a straight approach diamond wheel is presented to generate one or two flats to specific C-axis coordinates relative to the grain structure of the crystal. The results are increased productivity, lower production cost, & consistently high quality. Silicon wafer production cost is greatly reduced with Weldon’s unique multi -spindle design allowing OD, Flat, & Face grinding in the same operation. System Suppliers: ATS collet chuck, Setco sub-spindle, Encyclon coolant filtration system, Renishaw probe, GII electric dresser, Dittel acoustic emissions, Koolant Koolers tri-circuit spindle, linear motor, & coolant chiller, SBS automatic wheel balancer, Heidenhain linear & rotary glass scales, & FANUC 32i BT CNC control. Weldon Solutions offers a full line of CNC OD, ID, & combination grinders. As a FANUC Robotics integrator Weldon can also address your machine tending, material removal, material handling, & packaging/palletizing needs. QUALITY, Over and over again. www.weldonsolutions.com - [email protected] 425 East Berlin Road, York, PA 17408 - 717-846-4000 Contact Weldon today to find out how a new CNC grinder can enhance your manufacturing operation, & increase efficiency & profitability 2020 - 1078

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