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Phoenix X|aminer

Phoenix X|aminer

Phoenix X|aminer

Product catalog summary
Overview: The Phoenix X|aminer is an advanced X-ray inspection system designed for high-resolution inspection of electronic assemblies, components, and PCBAs. It integrates high-resolution 2D X-ray technology with optional 3D CT capabilities, making it suitable for power electronics applications.
Key Features & Benefits:
  • Equipped with a 160kV/20W microfocus X-ray tube with unlimited lifetime, ensuring effective penetration of high-absorbing components.
  • New DXR flat panel detector with CsI scintillator offers superior 85 µm resolution for enhanced image quality and live imaging performance.
  • Flash!TM Electronics technology optimizes image processing for electronics inspection, maximizing productivity with fast and accurate results.
  • Live CAD data overlay and automated X-ray sample mapping for easy orientation and inspection.
  • Anti-collision feature, small footprint, and a 27” 2K monitor for improved usability.
Inspection Capabilities:
  • High-quality X-ray inspection ensures product reliability by detecting defects in solder joints, including diameter, thickness, and voids.
  • Superior resolution DXR S85 detector improves failure detectability with better signal-to-noise ratio and pixel resolution down to 0.5 µm.
  • Phoenix X|act software allows for both manual and automated inspection, featuring easy macro recording and enhanced sample map functions.
Advanced Technologies:
  • OVHM-Technology enables oblique views up to 70 degrees with high magnification, providing detailed information not visible in top-down views.
  • Flash!TM Electronics offers intelligent image processing with excellent image quality optimized for electronics applications.
  • Phoenix Datos|x software package supports fast and easy 3D-CT inspection, combining all relevant CT imaging procedures.
Technical Specifications:
  • Options for X-ray detectors include a 1536 x 1536 pixel CsI detector and a high contrast 1536 x 864 pixel CMOS detector.
  • Geometric magnification exceeds 2000x, with total magnification over 91000x and detail detectability down to 0.5 µm.
  • System dimensions are 1800 mm x 1900 mm x 1430 mm, with a maximum sample size of 510 mm x 510 mm and weight of 5 kg.
  • Radiation safety features comply with German, French, and US standards, ensuring full protective installation.
Software and Modules:
  • Phoenix X|act base software includes image enhancement, measuring functions, and CNC inspection macro programming.
  • Standard modules for automatic BGA solder-joint evaluation and voiding calculation, with options for advanced inspection strategies.
  • Optional computed tomography capabilities with Phoenix Datos|x software for volume acquisition and reconstruction.
Advantages:
  • High defect coverage with easy usage and fast sample handling.
  • Automation capabilities and no need for tube exchange due to the unlimited lifetime of the X-ray tube.
  • Optional Flash!TM Electronics technology for optimized electronics inspection and a large monitor for better defect identification.
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Catalog excerpts

Phoenix X|aminer-1

OWaygate _ Technologies a Baker Hughes business Easy-to-use Your entry level high quality Electronics X-ray inspection solution

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Phoenix X|aminer-2

Phoenix X|aminer High quality 160kV microfocus X-ray inspection system with optional 3D CT The Phoenix X|aminer X-ray inspection system, combines high-resolution 2D X-ray technology and 3D CT in one, is designed for the special needs of the high-resolution inspection of electronic assemblies, components and PCBAs. The Phoenix X|aminer is equipped with an unlimited lifetime 160kV/20 W microfocus X-ray tube. Due to the high energy and power of the X-ray tube the system is an effective and reliable solution for electronic applications including power electronics. The Phoenix X|act technology offers...

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Phoenix X|aminer-3

High quality X-ray inspection to ensure product reliability The reliability of electronic assemblies strongly depends on solder joint quality. All dimensions and features of the solder joint are imaged: diameter, thickness (grey value), lands and contact areas (darker and brighter circles), voids (bright spots). All defects that have any influence on the solder joints shape are detectable. In addition to the visible surface the X-ray image reveals hidden features of the interconnection, which are most important for the reliability of solder joints. Waygate Technologies new brilliant detector...

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Phoenix X|aminer-4

OVHM-Technology  - oblique views at highest magnification Conventional tilt techniques generate oblique views by simply tilting the sample, which involves moving the region of interest away from the X-ray tube resulting in a decrease in magnification. The OVHM|module was specifically designed to enable oblique views of up to 70 degrees and 0 to 360 degree rotations at highest magnification. X-ray tube Unlike with conventional systems, the X-ray tube is located above the sample tray allowing the user to move the sample as close to the tube head as needed. Only this guarantees highest magnification...

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Phoenix X|aminer-5

Flash!TM Electronics – Intelligent image processing for electronics Combining 25+ years of experience and patents with next-generation technology, Flash!TM Electronics automatically optimizes digital radiography of electronics quickly and consistently. It delivers exceptional image quality and comfortable reading with a faster, smoother workflow enhancing productivity. • Excellent, consistent image quality optmized for electronics applications • Rendering of all relevant image data, optimized for the human eye • Robust image processing and operator independent • Easy to learn and use, One-Click-Solution...

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Phoenix X|aminer-7

Technical specifications and configurations (cont.) Phoenix X|aminer Image processing software Phoenix X|act base: comprehensive X-ray inspection software comprising image enhancement functions, measuring functions and CNC inspection macro programming for semi-automatic inspection BGA|module (standard): intuitive automatic BGA solder-joint evaluation incl. automatic wetting analysis VC|module (standard): intuitive automatic voiding calculation software package incl. capability of multiple die attach void evaluation. Manual inspection even of unregulary shaped area solderings. C4|module: view...

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Phoenix X|aminer-8

Phoenix X|aminer - Your Advantages • Extremely high defect coverage to assure highest quality requirements at easiest usage • Fast and easy sample handling • Automation capabilities • No tube exchange necessary because of unlimited lifetime of the X-ray tube • Best detail detectability down to 0.5 µm • Optional Flash!TM Electronics image optimization technology for best electronics inspection • Large 27’’ monitor for better defect identification • OPC-UA interface for improved efficiency and minimized downtime Proprietary BGA ADR for fast voiding detecting Waygate Technologies exclusive FLASH!TM...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.