PLCC-Socket - Solder Type

Product catalog summary

Technical Specifications
The PLCC-Socket is made from thermoplastic material rated UL94 V-0, with contact material being phosphor bronze. The contact surface is customizable with options over Ni (1.3 to 2.5µm). It meets solderability standards IEC512-12A, has a contact resistance of less than 30mΩ, insulation resistance greater than 1GΩ, and a test voltage of 500VRMS. The current rating is 1A, and it operates within a temperature range of -55°C to +105°C. The socket is processed using reflow-soldering, and it is recommended to populate the socket after soldering.

Dimensional Specifications
The document provides dimensions for various socket sizes, ranging from 20 to 84 contacts, with specific measurements for each size.

Reflow-Soldering Procedure
The reflow-soldering process should follow the IPC/JEDEC J-STD-020C temperature profile for lead-free soldering. Key parameters include an average ramp-up rate of 3°C/second max, preheat temperatures between 150°C and 200°C for 60-180 seconds, and a peak temperature of 260°C ± 5°C. The ramp-down rate should not exceed 6°C/second, and the total time from 25°C to peak temperature should be a maximum of 8 minutes.

Catalog excerpts

196 PLCC-Fassungen - Einlöt-Version PLCC-Socket - Solder Type © W+P PRODUCTS TEL.: +49 5223 98507-0 FAX.: +49 5223 98507-50 E-MAIL: [email protected] INTERNET: www.wppro.com 1 Technische Daten / Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Kontaktmaterial Phosphorbronze Contact Material Phosphor bronze Kontaktoberfläche Lt. Oberflächenoptionen, über Ni (1,3 ... 2,5ìm) Contact Surface Acc. to options (see below), over Ni (1,3 ... 2,5ìm) Lötbarkeit IEC512-12A Solderability IEC512-12A Durchgangswiderstand < 30mW Contact Resistance < 30mW Isolationswiderstand > 1GW Insulation Resistance > 1GW Spannungsfestigkeit 500VRMS Test Voltage 500VRMS Nennstrom 1A Current Rating 1A Temperaturbereich -55°C ... +105°C Temperature Range -55°C ... +105°C Verarbeitung Reflow-Lötverfahren; weitere Informationen in Kapitel T Processing Reflow-soldering, detailed information in ch. T Die Chipbestückung kann erst nach dem Lötprozess erfolgen. We strongly recommend to populate the socket after soldering. n A ± 0.20 B ± 0.20 C ± 0.10 D ± 0.10 20 15.56 15.56 5.08 5.08 28 18.10 18.10 7.62 7.62 32 18.10 20.64 7.62 10.16 44 23.18 23.18 12.70 12.70 52 25.72 25.72 15.24 15.24 68 30.80 30.80 20.32 20.32 84 35.88 35.88 25.40 25.40 Series Contacts* Plating 196 28 50 20/28/32/44/52/68/84 50 Verzinnt (Standard) Tin plated (Standard) ( * Bestellbeispiel - Bitte durch Ihre Spezifikationen ersetzen. * Order example - To be replaced by your specifications.)

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Informationen zum Reflow-Lötverfahren Reflow-Soldering Information TEL.: +49 5223 98507-0 FAX.: +49 5223 98507-50 E-MAIL: [email protected] INTERNET: www.wppro.com 2 Reflow-Lötverfahren Reflow-Soldering Bauteile sollten gemäß folgendem Temperatur-Profil in Anlehnung an die IPC/JEDEC J-STD-020C für bleifreies Löten im Reflowverfahren verarbeitet werden (Maximalwerte) Profil Eigenschaft Bleifreies Löten Durchschnitts-Ramp-Up Rate (Tsmax to Tp) 3°C / Sek. Max. Vorheizen - Temperatur Min (Tsmin) - Temperatur Max (Tsmax) - Zeit (tsmin auf tsmax) 150°C 200°C 60-180 Sekunden Verbleiben oberhalb: - Temperatur...

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PLCC-Socket - Solder Type

PLCC-Socket - Solder Type

Catalog excerpts

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