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PGA-Sockets

Product catalog summary

Technical Specifications
The document provides technical specifications for PGA sockets. The case, cover, and actuator are made of thermoplastic material rated UL94 V-0. The contact material includes a screw-machined brass sleeve and a 4-finger clip made of beryllium-copper. The contact surface is plated over nickel (2-3µm) according to specified options. The sockets have a contact resistance of less than 10mΩ and an insulation resistance greater than 10GΩ. They can withstand a test voltage of 1000VRMS and operate at 100VRMS / 150VDC with a current rating of 1A. The temperature range is -25°C to +85°C, and they are processed using reflow soldering.

Reflow Soldering Procedure
The reflow soldering process should follow the IPC/JEDEC J-STD-020C temperature profile for lead-free soldering. Key parameters include an average ramp-up rate of 3°C/second max, preheat temperatures between 150°C and 200°C for 60-180 seconds, and a peak temperature of 260°C +/- 5°C. The time above 217°C should be 60-180 seconds, with a ramp-down rate of 6°C/second max. The total time from 25°C to peak temperature should not exceed 8 minutes.

Ordering Information
The document includes a section on ordering codes, specifying different plating options such as tin-plated (standard), 0.25µm gold-plated, and 0.75µm gold-plated. Additional layouts and data sheets are available upon request.

Catalog excerpts

195 PGA-Fassungen PGA-Sockets © W+P PRODUCTS TEL.: +49 5223 98507-0 FAX.: +49 5223 98507-50 E-MAIL: [email protected] INTERNET: www.wppro.com 1 Technische Daten /Technical Data Gehäuse/Abdeckung/Hebel Thermoplastischer Kunststoff, nach UL94 V-0 Case/Cover/Actuator Thermoplastic, rated UL94 V-0 Kontaktmaterial Hülse: Messing gedreht Feder: 4-Lamellen-Clip, Beryllium-Kupfer Contact Material Sleeve: screw machined brass Clip: 4 Finger-Clip, Beryllium-Copper Kontaktoberfläche Lt. Oberflächenoptionen, über Ni (2 ... 3ìm) Contact Surface Acc. to options (see below), over Ni (2 ... 3ìm) Lötbarkeit IEC512-12A Solderability IEC512-12A Durchgangswiderstand < 10mW Contact Resistance < 10mW Isolationswiderstand > 10GW Insulation Resistance > 10GW Spannungsfestigkeit 1000VRMS Test Voltage 1000VRMS Betriebsspannung 100VRMS / 150VDC Operating Voltage 100VRMS / 150VDC Nennstrom 1A Current Rating 1A Temperaturbereich -25°C ... +85°C Temperature Range -25°C ... +85°C Verarbeitung Reflow-Lötverfahren; weitere Informationen in Kapitel T Processing Reflow-soldering, detailed information in ch. T Series Contacts* Sleeve Plating* Clip Plating* 195 084-11-0 50 10 Bestell-Code aus Bestückungslayout angeben Please fill in layout code 50 Verzinnt (Standard) Tin plated (Standard) 10 Vergoldet 0,25ìm 0,25ìm gold plated 00 Vergoldet Gold plated 10 Vergoldet 0,25ìm 0,25ìm gold plated 30 Vergoldet 0,75ìm 0,75ìm gold plated Weitere Layouts und Datenblätter auf Anfrage. More layouts and data sheets on request.

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195 PGA-Fassungen PGA-Sockets TEL.: +49 5223 98507-0 FAX.: +49 5223 98507-50 E-MAIL: [email protected] INTERNET: www.wppro.com 2 ( * Bestellbeispiel - Bitte durch Ihre Spezifikationen ersetzen. * Order example - To be replaced by your specifications.)

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Informationen zum Reflow-Lötverfahren Reflow-Soldering Information TEL.: +49 5223 98507-0 FAX.: +49 5223 98507-50 E-MAIL: [email protected] INTERNET: www.wppro.com 3 Reflow-Lötverfahren Reflow-Soldering Bauteile sollten gemäß folgendem Temperatur-Profil in Anlehnung an die IPC/JEDEC J-STD-020C für bleifreies Löten im Reflowverfahren verarbeitet werden (Maximalwerte) Profil Eigenschaft Bleifreies Löten Durchschnitts-Ramp-Up Rate (Tsmax to Tp) 3°C / Sek. Max. Vorheizen - Temperatur Min (Tsmin) - Temperatur Max (Tsmax) - Zeit (tsmin auf tsmax) 150°C 200°C 60-180 Sekunden Verbleiben oberhalb: - Temperatur...

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PGA-Sockets

PGA-Sockets

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