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IC Socket / IC-Strip - Standard Version - Height 4,2mm

IC Socket / IC-Strip - Standard Version - Height 4,2mm

IC Socket / IC-Strip - Standard Version - Height 4,2mm

Product catalog summary
Technical Specifications:
The document provides specifications for IC Sockets and IC Strips with a standard height of 4.2mm. The components are made from thermoplastic rated UL94 V-0. Contact materials include screw machined brass sleeves and 4-finger clips made of beryllium-copper. The contact surface options are over nickel (2-3µm). The solderability complies with IEC512-12A standards. Key electrical properties include a contact resistance of less than 10mΩ, insulation resistance greater than 10GΩ, test voltage of 1000VRMS, operating voltage of 100VRMS/150VDC, and a current rating of 1A. The temperature range is -25°C to +85°C. The components are suitable for reflow-soldering and compatible with round pins (Ø 0.4-0.56mm) or square pins (0.25 x 0.45mm).
Product Variants:
The document lists different series and plating options for IC Sockets and IC Strips. The IC Socket series 169 offers various contact and row configurations with tin or gold plating options. The IC Strip series 182 provides single or double row configurations with similar plating options.
Reflow-Soldering Procedure:
The recommended reflow-soldering profile follows the IPC/JEDEC J-STD-020C standard for lead-free soldering. Key parameters include an average ramp-up rate of 3°C/second max, preheat temperatures between 150°C and 200°C for 60-180 seconds, and a peak temperature of 260°C +/- 5°C. The time above 217°C should be maintained for 60-180 seconds, with a ramp-down rate of 6°C/second max. The total time from 25°C to peak temperature should not exceed 8 minutes.
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Catalog excerpts

IC Socket / IC-Strip - Standard Version - Height 4,2mm-1

DMC-1400_DS_0810.indd tr.row {} td.cell {} div.block {} div.paragraph {} .font0 { font:7.00pt "Arial", sans-serif; } .font1 { font:10.00pt "Arial", sans-serif; } .font2 { font:11.00pt "Arial", sans-serif; } .font3 { font:27.00pt "Arial", sans-serif; } .font4 { font:4.00pt "Palatino Linotype", serif; } .font5 { font:7.00pt "Times New Roman", serif; } Technische Daten /Technical Data Gehuse/Abdeckung/Hebel Thermoplastischer Kunststoff, nach UL94 V-0 m \ o D □ O q: □_ Case/Cover/Actuator Kontaktmaterial Contact Material Kontaktoberflache Contact Surface L◴tbarkeit Solderability Durchgangswiderstand Contact Resistance Isolationswiderstand Insulation Resistance Spannungsfestigkeit Test Voltage Betriebsspannung Operating Voltage Nennstrom Current Rating Temperaturbereich Temperature Range Verarbeitung Processing Thermoplastic, rated UL94 V-0 Hlse: Messing gedreht Feder: 4-Lamellen-Clip, Beryllium-Kupfer Sleeve: screw machined brass Clip: 4 Finger-Clip, Beryllium-Copper Lt. Oberflachenoptionen, ber Ni (2 ... 3um) Acc. to options (see below), over Ni (2 ... 3ym) IEC512-12A IEC512-12A < 10mW < 10mW > 10GW > 10GW 1000Vrms 1000Vrms 100Vrms/150Vdc 100Vrms / 150Vdc 1A 1A -25°C ... +85°C -25°C ... +85°C Reflow-L뻴tverfahren; weitere Informationen in Kapitel T Reflow-soldering, detailed information in ch. T LL i Fr Rundstifte 0 0,4 ... 0,56mm oder Vierkantstift 0,25 x 0,45mm. For round pin 0 0,4 ... 0,56mm or square pin 0,25 x 0,45mm. Sries Contacts* DIP* ■ 3- Sleeve Plating Clip Plating* 169 14 50 00 169 IC-Fassung IC-Socket 08/14/16/18/ 20/22/24/28 22/24 24/28/32/40 50/52/64 3 7,62mm 4 10,16mm 6 15,24mm 9 22,86mm 50 Verzinnt (Standard) Tin plated (Standard) 00 Vergoldet (Standard) Gold plated (Standard) 10 Vergoldet 0,25um 0,25ym gold plated 30 Vergoldet 0,75um 0,75ym gold plated Clip Plating* Series Contacts* Rows* Sleeve Plating 182 14 .1. 50 10 182 IC-Leiste IC-Strip 01-64 Einreihig Single row 02-64 Zweireihig Double row 1 Einreihig Single row 2 Zweireihig Double row 50 Verzinnt (Standard) Tin plated (Standard) 00 Vergoldet (Standard) Gold plated (Standard) 10 Vergoldet 0,25um 0,25ym gold plated 30 Vergoldet 0,75um 0,75ym gold plated (* Bestellbeispiel - Bitte durch Ihre Spezifikationen ersetzen. * Order example - To be replaced by your specifications.) TEL.: +49 5223 98507-0 FAX.: +49 5223 98507-50 W+P PWDUC멯l E-MAIL: [email protected] INTERNET: www.wppro.com 1

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IC Socket / IC-Strip - Standard Version - Height 4,2mm-2

Informationen zum Reflow-Lötverfahren Reflow-Soldering Information TEL.: +49 5223 98507-0 FAX.: +49 5223 98507-50 E-MAIL: [email protected] INTERNET: www.wppro.com 2 Reflow-Lötverfahren Reflow-Soldering Bauteile sollten gemäß folgendem Temperatur-Profil in Anlehnung an die IPC/JEDEC J-STD-020C für bleifreies Löten im Reflowverfahren verarbeitet werden (Maximalwerte) Profil Eigenschaft Bleifreies Löten Durchschnitts-Ramp-Up Rate (Tsmax to Tp) 3°C / Sek. Max. Vorheizen - Temperatur Min (Tsmin) - Temperatur Max (Tsmax) - Zeit (tsmin auf tsmax) 150°C 200°C 60-180 Sekunden Verbleiben oberhalb: - Temperatur...

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