5051 series - SMT Board-to-Board Connectors

Product catalog summary

Technical Specifications:
The SMT Board-to-Board Connectors have a 0.50mm pitch and are of a compact type. The insulator is made of thermoplastic rated UL94 V-0, and the contact material is a copper alloy with a gold over nickel surface. The connectors have a contact resistance of less than 50mΩ and an insulation resistance greater than 100MΩ. They are rated for a test voltage of 100VAC, a voltage rating of 50V AC, and a current rating of 0.5A. The temperature range is -20°C to +125°C, and they are processed using reflow soldering.

Series and Packaging:
The series type 5051 includes male connectors with heights ranging from 2.40mm to 4.40mm and female connectors with heights from 2.20mm to 3.50mm. All connectors are gold plated. Packaging options include tubes with Pick&Place-Pad (PPST) and tape & reel with P&P-Pad (PPTR).

Reflow Soldering Recommendations:
The components should be soldered according to the IPC/JEDEC J-STD-020C temperature profile for lead-free reflow soldering. Key values include a minimum temperature (TSmin) of 150°C, a maximum temperature (TSmax) of 200°C, and a soldering range temperature (TL) of 217°C. The peak temperature (TP) is 260°C ±5, with a duration of 20-40 seconds at peak temperature. The ramp-up rate is a maximum of 3°C/s, and the ramp-down rate is 6°C/s, with a total duration from 25°C to peak temperature not exceeding 8 minutes.

Catalog excerpts

5051 series - SMT Board-to-Board Connectors-1

5051 SMT Board-to-Board Verbinder RM 0,50mm - Kompakttyp SMT Board-to-Board Connectors, 0.50mm Pitch - Compact Type Technische Daten / Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Kontaktmaterial Kupferlegierung Contact Material Copper alloy Kontaktoberfläche Gold über Nickel Contact Surface Gold over nickel Lötbarkeit IEC 60512-12A Solderability IEC 60512-12A Durchgangswiderstand < 50mΩ Contact Resistance < 50mΩ Isolationswiderstand > 100MΩ Insulation Resistance > 100MΩ Spannungsfestigkeit 100VAC Test Voltage 100VAC Nennspannung 50V AC Voltage Rating 50V AC Nennstrom 0,5A Current Rating 0.5A Temperaturbereich -20°C ... +125°C Temperature Range -20°C ... +125°C Verarbeitung Reflow-Lötverfahren Processing Reflow soldering PPST PPTR E-MAIL [email protected] WEBSITE www.wppro.com 1

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5051 series - SMT Board-to-Board Connectors-2

5051 SMT Board-to-Board Verbinder RM 0,50mm - Kompakttyp SMT Board-to-Board Connectors, 0.50mm Pitch - Compact Type * Dies ist ein Bestellbeispiel bitte durch Ihre Spezifikationen ersetzen. * This is an order example please replace by your specifications. 00 00 Vergoldet Gold plated PPTR PPST In Stangen mit P&P-Pad In tubes with P&P-Pad PPTR Tape & Reel mit P&P-Pad Tape & Reel with P&P-Pad Lieferformen / Packaging Options: PPST In Stangen mit Pick&Place-Pad / In tubes with Pick&Place-Pad PPTR Tape & Reel mit P&P-Pad / Tape & Reel with P&P-Pad E-MAIL [email protected] WEBSITE www.wppro.com

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5051 series - SMT Board-to-Board Connectors-3

Informationen zum Reflow-Lötverfahren Reflow Soldering Information Reflow-Lötempfehlung Reflow Soldering Recommendation Die Bauteile sollten gemäß folgendem TemperaturProfil in Anlehnung an die IPC/JEDEC J_STD-020C für bleifreies Löten im Reflow-Verfahren verarbeitet werden (Maximalwerte). Temperatur Minimum TSmin Temperatur Maximum TSmax Dauer TSmin - TSmax Ramp-Up Rate TSmax - TP Dauer Höchsttemperatur Items should be soldered according to IPC/JEDEC J-STD-020C temperature profile for leadfree reflow soldering (maximum values). Ramp-Down Rate TPmax - TSmin Profile Feature Minimum Temperature...

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5051 series - SMT Board-to-Board Connectors

5051 series - SMT Board-to-Board Connectors

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