SMT EMI Gaskets and Grounding Pads
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GORE SMT EMI Gaskets and Grounding Pads ® SUPERSOFT SERIES FOR AUTOMOTIVE ELECTRONICS Exceptional EMI protection with easy SMT integration In automotive electronic devices, grounding and shielding products must ensure electrical performance without breaking under severe mechanical and environmental stress throughout the vehicle service life. However, metal spring contacts and clips typically create single point contact that can fatigue over time and decrease electrical performance after exposure to conditions such as vibration, shock, extreme temperatures and other challenging road conditions. In addition, metal contacts can scratch mating surfaces damaging the device enclosure and generating conductive particles. All of these issues can compromise device performance leading to failure and warranty issues. GORE® SMT EMI Gaskets and Grounding Pads, Supersoft Series delivers excellent electrical performance by providing reliable grounding and shielding in challenging automotive conditions. These components ensure consistent grounding through a large conformable contact area for low DC resistance throughout the vehicle service life. In addition, the patented construction of the Supersoft Series reduces the likelihood of enclosure surface abrasion and particulation (Table 1 and Figure 1). Benefits of GORE® SMT EMI Gaskets and Grounding Pads, Supersoft Series Increased Design Flexibility and Easy Integration • Reduced electromagnetic interference (EMI) and crosstalk in challenging environments The Supersoft Series offers a convenient design compatible with surface mount technology (SMT) that can be easily integrated into existing production lines. These off-the-shelf components eliminate the need for custom designs and secondary processing. This translates to increased flexibility in your designs, easy installation, faster production rates and lower total costs over time. Proven Track Record For more than 10 years, GORE® SMT EMI Gaskets and Grounding Pads, Supersoft Series has delivered reliable performance in many automotive electronics. The Supersoft Series can be reliably used in typical applications such as: • Advanced driver assistance systems (ADAS) • Cameras and radar systems • Connectivity devices • Infotainment systems • Instrument cluster control modules • Navigation systems • Powertrain electronics • Telematics control units (TCU) • Large conformable contact area for low DC resistance throughout vehicle service life due to patented construction • Reduced likelihood of enclosure surface abrasion and particulation • Increased design flexibility and reduced total costs with easily integrated standard parts versus custom designs • Faster production rates because of consistent and repeatable assembl

GORE® SMT EMI Gaskets and Grounding Pads supersoft series for automotive electronics Reliable Performance The Supersoft Series of GORE® SMT EMI Gaskets and Grounding Pads have been extensively tested according to the following performance standards. Please contact your Gore representative for more detailed information. Figure 2: Environmental Performance Testing of Supersoft Series Mechanical Performance Performance after vibration at various temperatures Method: • ISO 16750-3 Test Conditions: • 32 hr/ plane • 3 primary planes • Overlay Temperature: Tmin: -40 °C Tmax: +150 °C V _J...

Table 2: SupersoftSeries Typical Performance1 1 Values are for reference only and are not intended for specification purposes. Outstanding Recoverability If a module is re-opened for modifications during initial production, testing or rework, the grounding pads must be able to rebound and create a consistent and reliable connection. Recoverability measures the gasket’s ability to maintain gap filling following a release of a compression load. Using the Standard Test Methods for Rubber Property — Compression Set, results showed that the Supersoft Series demonstrated outstanding...

GORE® SMT EMI Gaskets and Grounding Pads supersoft series for automotive electronics Selection Guidelines The Supersoft Series is engineered to survive multiple reflow processes and maintain conductivity in a wide range of compressed part heights (gap distances). Specific application requirements depend upon the following criteria: • Gap distance between the Printed Circuit Board (PCB) and the mating surface (Figure 5) Figure 5: Recommended Compressed Part Heights for Supersoft Series Table 4: Recoverability of Supersoft Series • Compression force between the mating surface and Gore’s part...