GORE® SMT EMI Gaskets and Grounding Pads
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GORE SMT EMI Gaskets and Grounding Pads ® Excellent electrical performance with SMT convenience GORE® SMT EMI Gaskets and Grounding Pads combine unsurpassed conductivity with the convenience of SMTcompatible format. These conformable components are engineered to maintain consistent contact and low DC resistance. Unlike the traditional designs of pogo pins and universal clips that can easily break, the robust design of GORE® SMT EMI Gaskets and Grounding Pads increase durability with large contact surfaces rather than single-point contacts. The unique construction of GORE® SMT EMI Gaskets and Grounding Pads ensures that the device maintains signal integrity and reliable electrical performance in harsh environments. Because of their compatibility with SMT equipment for printed circuit board production, GORE® SMT EMI Gaskets and Grounding Pads reduces total costs. Using these off-the-shelf components eliminates the need for custom designs that can increase engineering costs. Also, no secondary processing is required, which reduces equipment and labor costs during production. Using precise SMT equipment to incorporate GORE® SMT EMI Gaskets and Grounding Pads improves the consistency and repeatability of PCB assembly, thus decreasing waste. GORE® SMT EMI Gaskets and Grounding Pads offer a full spectrum of working ranges, making them ideal for use as grounding pads, EMI gaskets, and antenna contacts. The highly compressible SMT Supersoft Series delivers consistent electrical performance with minimal force required for initial conductivity. The SMT GS5200 Series offers the highest conductivity under compression in Gore’s EMI shielding product line. In addition to these high-performance characteristics, GORE® SMT EMI Gaskets and Grounding Pads have been tested against a variety of environmental standards (Table 1). Benefits of GORE® SMT EMI Gaskets and Grounding Pads • Excellent shielding effectiveness and low DC resistance with conformable construction • Reliable electrical performance achieved through consistent contact over time • Reduced total costs versus custom options due to standard sizes and compatibility with SMT technology • Increased design flexibility with easily integrated standard parts • Consistent and repeatable assembly with parts that need no secondary processing • Enhanced durability due to conformable material that maintains contact over time without compromising the integrity of the mating surface • Faster production times because of standard solder process that requires no cure time Typical Applications • Portable electronic devices such as smartphones and tablets • GPS and handheld scanners/readers • Telematics • Gaming devices • Personal computers and laptops • Telecommunication infrastructure GORE® SMT EMI Gaskets and Grounding Pads are covered by patent No. US 6,255,581 B1 and US 6,210,789 B1. Corresponding foreign patents issued. GORE® SMT EMI Gaskets and Grounding Pads - SMT Supersoft Series is covered by patent No. US 6,255,581 B1 and US 7,129,421 B

PHASEFLEX EMI Gaskets and Grounding Pads GORE SMT ® MICROWAVE/RF TEST ASSEMBLIES Figure 1: Recommended Service Heights for SMT Supersoft Series Table 1: Environmental Properties Operating temperatures RoHS Status* (lead, cadmium, hexavalent chromium, mercury, bromine) Flammability in accordance with UL horizontal burn method *W. L. Gore & Associates declares that we do not intentionally add substances listed in EU Directive 2011/65/EU to GORE® SMT EMI Gaskets and Grounding Pads. Independent lab tests have been performed and results are available upon request. Selection Guidelines • Gap...

GORE® SMT EMI Gaskets and Grounding Pads — SMT Supersoft Series The SMT Supersoft Series is highly compressible to ensure consistent electrical performance. These components are conductive on contact and resilient after compression (Table 2). This combination of highly compressible construction and minimal force requirements makes them an excellent choice for use with metallized plastic housings and a variety of components, including LCDs, flexible circuits, antennas, and cameras. In addition, the SMT Supersoft Series protects against harsh conditions like shock and vibration encountered in...

PHASEFLEX EMI Gaskets and GroundingSMT Series GORE SMT Pads ® MICROWAVE/RF TEST ASSEMBLIES Figure 3: DC Resistance through ALT for 25SMT-4442-01 Median Maximum Test Standards Force Displacement Resistance of SMT Supersoft Series The SMT Supersoft Series provides conductivity on contact; however, the amount of force and DC resistance differs for each variant as seen in Table 2 and Figures 4-5. Figure 4: Force Displacement Resistance for 25SMT-4442-01 1000 (145.0) Recoverability is the inverse of compression set. If a device will be opened for modifications during initial production, hardware...

GORE® SMT EMI Gaskets and Grounding Pads — SMT GS5200 Series The SMT GS5200 Series offers the highest conductivity under compression in Gore’s EMI Shielding product line (Table 5). The durability of these components extends their service life in challenging environments such as ruggedized scanners/ readers, gaming devices, and wireless infrastructure. These highly conductive components recover easily after compression. Ideal for small footprint applications and for metal housings, the SMT GS5200 Series provides high performance and excellent reliability. Table 5: SMT GS5200 Series Typical...

PHASEFLEX EMI Gaskets and Grounding Pads GORE SMT ® MICROWAVE/RF TEST ASSEMBLIES Accelerated Life Testing for SMT GS5200 Series Figure 7: DC Resistance through ALT for 0.72 mm SMT GS5200 Series Parts A crucial factor in assessing the acceptability of gaskets or grounding pads is their performance over time — performance that can be evaluated only through accelerated life testing. To evaluate durability of the SMT GS5200 Series, industry testing was performed at various conditions (Table 6) with parts soldered to a test board. Figures 6-9 show the changes in DC resistance following exposure...