LSM0805 Series 0805 SMD LED Package 2.0x1.25x0.8 mm SMD Chip LED LSM0805412V Red SMD LED. Low Profile Surface Mount LED with High intensity light output and low power consumption • Health Care Application • Industrial Control Systems • Status Indicator Application • Wearable and Portable Devices • Home and Smart Appliance • Automotive Features • Backlit Keypads • Navigations Systems • Medical Devices Key Features • 2.0 x 1.25 mm [.079 x .049 in] (0805package/2012 metric) Chip SMD LED • 0.8 mm [.031 in] in thickness • Low power consumption • Rectangle flat top LED • Wide viewing angle (120°) • Optimized light coupling by inter reflector • GaInP technology • Top emitting package • Small 0805 LED package, flexible application with small space required. • Available in a range of colors: red, white, green, blue and yellow making it ideal for status indication • Cost-efficient solution for low-power and compact electronic equipment designs • Compatible with automatic placement equipment and available in automation-friendly tape and reel • Ideal for special configurations for automated PC board assembly and space-sensitive applications • Pb-free • Moisture sensitivity level: 3 • Package 3,000 pieces per reel • Compliant with RoHS and REACH

Ordering Data Product Dimensions Recommended Soldering Pattern [.039] 1.0 Notes: 1. All dimensions are in mm [in] 2. Tolerance is ±0.1 mm unless otherwise noted vcclite.com | 1.800.522.5546

Product Specifications Absolute Maximum Ratings (ta=25°C) 1. Tolerance of Luminous Intensity ±3% 2. Tolerance of Dominant Wavelength ±1nm 3. Tolerance of Forward Voltage ±0.03V

Typical Electrical-Optical Characteristics Curves Luminous Intensity Vs. Ambient Temperature Forward Current Derating Curve Forward Current IF (mA) Radiation Diagram c 2 3 o 2 co

The reliability of products shall be satisfied with items listed below. Confidence level: 90%

Recommended Reflow Soldering Profile Reflow Soldering Use the conditions shown in the figure below for PB-Free Reflow Soldering. Maximum Solder Profile Recommended Solder Profile 255 240 Minimum Solder Profile • Reflow soldering should not be done more than two times. • Stress on the LEDs should be avoided during heating in soldering process. • After soldering, do not handle the product before its temperature drops down to room temperature.

• Storage Moisture proof and anti-electrostatic package with moisture absorbent material are used, to keep moisture to a minimum. Before opening the package, the product should be kept at 30°C or less and humidity less than 60%Rh, and be used within a year. After opening the package, the product should be stored at 30°C or less and humidity less than 10%RH, and be soldered within 24 hours. It is recommended that the product be operated at the workshop condition of 30°C or less and humidity less than 60%RH. If the moisture absorbent material has faded away or the LEDs have exceeded the storage...

Notes: 1. All dimensions are in mm [in] 2. Tolerance is ±0.1 mm unless otherwise noted