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MFU AT SERIES

MFU AT SERIES
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Vishay Beyschlag Thin Film Chip Fuse FEATURES • Advanced thin film technology • AEC-Q200 qualified (1) • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Advanced sulfur resistance verified according to ASTM B 809 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 MFU AT thin film chip fuses are the perfect choice for automotive electronics. The highly controlled manufacturing thin film process guarantees an outstanding stability of fusing characteristics. Typical automotive applications include electro vehicle and hybrid electro vehicle, battery management and circuit protection for small loads. APPLICATIONS • Electro vehicle • Hybrid electro vehicle • Battery management • Circuit protection of small loads TECHNICAL SPECIFICATIONS DESCRIPTION Imperial size Metric size code Rated current range IR Rated voltage, Umax. DC Breaking capacity, Imax. at Umax. DC Permissible film temperature, F max. Operating temperature range Permissible continuous current rating at amb = 23 °C Approval UL / CSA recognition file Failure rate: FITobserved Note (1) According to Vishay’s automotive chip fuse qualification requirements Document Number: 28930 1 For technical questions, contact: fuse@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET

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Vishay Beyschlag PACKAGING TYPE / SIZE PACKAGING DIMENSIONS PACKAGING STYLE Paper tape acc. IEC 60286-3 Type 1a PART NUMBER AND PRODUCT DESCRIPTION Part Number: MFU0603FF01000P5AT TYPE / SIZE FUSING CHARACTERISTIC RATED CURRENT FF = very quick acting RATED CURRENT FF = very quick acting Note • Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION MFU 0603 AT RATING - Very quick acting (FF) FUSE CHAR. VOLT. COLD BREAKING PRE-ARCING (1) DROP (1) RESIS. (1) CAPACITY MARK. APPROVAL I2t at at DC at 10 x IR 1 x IR 0.1 x IR RATED CURRENT RATED VOLTAGE Notes (1) Typical...

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Vishay Beyschlag Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade ceramic substrate (Al2O3). The fuse elements are covered by a protective coating designed for electrical, mechanical, and climatic protection. The terminations receive a final pure matte tin on nickel plating. Vishay acknowledges the following systems for the regulation of hazardous substances: The result of the determined production is verified by an extensive testing procedure performed on 100 % of...

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Vishay Beyschlag FUNCTIONAL PERFORMANCE Axis Title 110 2nd line Current Rating Factor (%) ϑamb - Ambient Temperature (°C) Current Rating Factor (1) vs. Ambient Temperature amb Axis Title 102 2nd line tpre-arc - Time (s) Typical tpre-arc vs. I Characteristic of MFU 0603 AT (2) Axis Title 102 2nd line I2t - Joule Integral (A2s) Typical I2t vs. tpre-arc Characteristic of MFU 0603 AT (2) Notes (1) Current rating factor is in addition to the given permissible continuous current rating of 0.7 (2) Fuses mounted on a test board according to IEC 60127-4 Revision: 30-Apr-2021 Document Number: 28930...

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Vishay Beyschlag TEST AND REQUIREMENTS All tests are carried out in accordance with the following specifications: Unless otherwise specified the following values apply: IEC 60 127-1, Miniature fuse - Part 1: definitions for miniature fuses and general requirements for miniature fuse-links Temperature: 15 °C to 35 °C Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). The components are mounted for testing on printed-circuit boards in accordance with IEC 60127-4, unless otherwise specified. IEC 60127-4, Universal Modular Fuse Links (UMF) UL 248-14, Low voltage fuses - Part 14:...

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Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS IEC 60068-2 TEST METHOD REQUIREMENTS PERMISSIBLE CHANGE Maximum sustained dissipation acc. to IEC 60127-1 Calculation in accordance with results of clause 9.4 b) Fuse-link temperature Verification of temperature rise and currentcarrying capacity acc. to UL 248-14 clause 8.2.3 Damp heat, steady state Damp heat, steady state, accelerated Rapid change of temperature The test is performed during the final 5 min of clause 9.4 b) Temperature rise of terminals  95 K Temperature rise of hot spot  75 K acc. to UL 248-14 clause 8.2.4 Endurance by...

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Vishay Beyschlag DIMENSIONS AND MASS TYPE / SIZE RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE Note • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters Document Number: 28930 7 For technical questions, contact: fuse@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS...

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Legal Disclaimer Notice www.vishay.com Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any...

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