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Bare Die

Bare Die

Product catalog summary

Introduction to Bare Die
This document provides an overview of Vishay Intertechnology's range of small-signal and power diodes available in bare die and wafer form. It covers various types of diodes including Schottky, ultrafast, TVS, Zener, ESD protection, switching diodes, high voltage standard/fast diodes, and thyristors.

Die Portfolio
The portfolio includes a wide range of diodes with specific nomenclature for each type. Schottky diodes are noted for their fast switching capabilities and low forward voltage drop, suitable for applications like solar cell bypass diodes and battery protection. Ultrafast diodes, including FRED Pt® and HEXFRED®, are highlighted for their speed and efficiency in high-frequency applications.

Packing Options
Vishay offers several packing options for bare die products to accommodate various assembly techniques, including unsawn wafers, sawn wafers on film, die in tape and reel, and waffle packs.

Die Usage Guidelines
Guidelines emphasize careful handling and storage of bare die products to prevent damage. Recommendations include using specific solderable layers for die attach and appropriate wire bonding techniques to ensure optimal performance.

Naming Rules
The document details naming conventions for different diode types, including Schottky, FRED Pt®, HEXFRED®, TVS diodes, high voltage standard/fast diodes, and thyristors. These rules help in identifying product specifications such as chip size, process, voltage, and packaging.

Schottky Diode Features
Schottky diodes are designed for fast switching and low forward voltage drop, making them efficient for applications requiring high efficiency and protection of MOS devices. Vishay offers a broad range of Schottky diodes with various junction temperatures and optimized for low conduction losses or low reverse leakage current.

Conclusion
The document serves as a comprehensive guide for selecting and using Vishay's bare die diode products, providing detailed specifications, application guidelines, and naming conventions to assist in product selection and assembly.

Specifications

Diodes: Lists ultrafast and standard/fast diodes with voltage ratings from 600V to 1600V and current handling capabilities up to 100A. Available with bondable and solderable metallization.
Thyristors: Rated from 600V to 1600V with a maximum junction temperature of 125°C, designed for high-power switching applications.
TVS Diodes: Designed for surge protection with breakdown voltages ranging from 6.8V to 47V and peak pulse power capabilities from 300W to 6.6kW.

Procedures and Recommendations

Contact Vishay for specific delivery versions and availability of different packaging options such as Die-on-wafer, Die-on-Film, Die-in-tape&reel, and Die-in-waffle-Pack.
Review datasheets for detailed specifications and performance metrics.

Applications

Diodes: Used in AC mains rectification, solar cell blocking, and alternator rectification.
Thyristors: Utilized in motor speed controllers, inverters, and AC bypass switches.
TVS Diodes: Provide general-purpose surge protection and automotive load dump protection.

Key Data from Tables

Diode and thyristor tables provide part numbers, current ratings, voltage ratings, maximum forward voltage, typical reverse recovery time, die size, and metallization details.
TVS diode tables include part numbers, technology type, breakdown voltage range, standoff voltage, die size, and metallization details.

Critical Information

Products are subject to change without notice, and specific disclaimers are available at the provided Vishay document link.
Maximum junction temperatures and metallization options are critical for application suitability.

Overview The document is a technical guide from Vishay Intertechnology, Inc., detailing a range of TVS (Transient Voltage Suppressor) diodes in bare die and wafer form. It includes specifications for various part numbers, their applications, and features of Zener and Switching diodes.

Specifications The document lists numerous TVS diodes with specific part numbers, each with detailed specifications including minimum and maximum breakdown voltage (V_BR), standoff voltage (V_WM), die size, recommended solderable dimensions, and wafer diameter. All diodes are noted to be solderable on both front and back sides, with a consistent die thickness of 12 mils and wafer diameter varying by product.

Procedures and Standards The document mentions that the products and document are subject to specific disclaimers available on the Vishay website. It also notes that the specifications are subject to change without notice.

Recommendations The document highlights the use of Zener diodes for voltage regulation, voltage reference, and protection against surge and ESD events. It also describes the use of Switching diodes for fast switching applications, noting their fast recovery times and suitability for high-frequency applications.

Key Features

Zener diodes are available with breakdown voltages from 2 V to 200 V, with a typical voltage tolerance of ±5%.
Switching diodes are designed for fast switching and are available in various power dissipation and reverse voltage ratings.
Vishay offers a range of diodes with bondable metallization, suitable for various applications including full-wave rectification and logic circuits.

Applications The document outlines typical applications for the diodes, including voltage regulation, diode clipping for AC signals, and protection of data lines against voltage transients.

Catalog excerpts

Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Products in Several Versions to Accommodate a Wide Variety of Assembly Techniques and Applications Schottky Diodes Standard/Fast Diodes Switching Diodes Ultrafast Diodes Zener Diodes Resources • For technical support contact [email protected] • For more information contact [email protected], [email protected], or [email protected] One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components selector guide This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Vishay supplies a wide range of small-signal and power diodes in bare die and wafer form: • Schottky diodes • Fred Pt® Ultrafast diodes • HEXFRED® Ultrafast diodes • TVS diodes • Zener diodes • ESD protection diodes • Switching diodes • High Voltage Standard/Fast diodes • Thyristors Packing Types Vishay delivers its bare die products in several versions to accommodate a wide variety of assembly techniques and applications: • Unsawn wafer: the wafers are delivered in a sealed bag and die are not singulated...

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Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Naming Rules for Schottky, FRED Pt®, HEXFRED® and TVS Diodes SC Product Type Chip size in mils SX = Planar Schottky Fab1 TY = TMBS® Schottky Fab1 TV = PAR® TVS SC = Planar Schottky Fab2 FD = FRED Pt Ultrafast H2 = HEXFRED Ultrafast Gen2 H3 = HEXFRED Ultrafast Gen3 For Schottky R = Tj max. 125 °C S = Tj max. 150 °C H = Tj max. 175 °C T = Gen5 Schottky For TVS PAR B = Named as Vbr T = Named as Vwm L = Load Dump Rectifier named as Vbr Surface Metal Wafer Diameter A = Wirebondable Topside: Ti/Al, Ti/Ni/Al...

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Diodes - A Wide Range of Bare Die and Wafer Form Products Digit always present Small-Signal and Power Diodes Digit might miss (see legend) DIODES Bare Die Naming Rule for Thyristors VS 180 Chip Size in Mils Surface Metal Passivation Process B = Wirebondable Topside: 100% Al Backside: Cr/Ni/Ag Vishay Semiconductor D = Wirebondable Topside: 100% Al Backside: Cr/Ni/Ag CB=Probed Uncut Die (Wafer In Box) None=Probed Die in Chip Carrier H = Solderable Topside: Cr/Ni/Ag Backside: Cr/Ni/Ag S = Solderable Topside: Cr/Ni/Ag Backside: Cr/Ni/Ag selector guide This document is subject to change without notice....

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Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Diode Features Schottky diodes are designed for very fast switching between the forward and the reverse direction of the diode. Their metal-semiconductor junction provides a low forward voltage drop compared to p-n diodes. Schottky diodes can be used for general-purpose applications but their low voltage drops at forward biases makes them useful whenever conduction losses are key to ensure high efficiency and for protection of MOS devices. Vishay Portfolio • ishay offers one of broadest range of Schottky diodes in the market,...

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Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Die/N List Die Front Side Back Side Thickness Metal Metal (mils) Wafer Diameter (inches) (1) In the Part Number “x” stands for the delivery version. Contact Vishay to check which among Die-on-Wafer, Die-on-Film, Die-in-tape and reel, Die-in-Waffle-Pack are available for chosen part number. (2) At IF of discrete packaged part or based on technology. Review datasheets for details. (3) Specs taken from datasheet of packaged part or from measurements in package. selector guide This document is subject to change without notice. THE...

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Diodes - A Wide Range of Bare Die and Wafer Form Products Schottky Die/N List Die Front Side Back Side Thickness Metal Metal (mils) Wafer Diameter (inches) Small signal (1) In the Part Number “x” stands for the delivery version. Contact Vishay to check which among Die-on-Wafer, Die-on-Film, Die-in-tape and reel, Die-in-Waffle-Pack are available for chosen part number. (2) At IF of discrete packaged part or based on technology. Review datasheets for details. (3) Specs taken from datasheet of packaged part or from measurements in package. selector guide This document is subject to change without...

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Diodes - A Wide Range of Bare Die and Wafer Form Products Ultrafast Diode Features These diodes are specifically designed to work in switching operations. Their silicon epitaxial planar technology features a design optimized for reliable performance. They are the best diodes for coupling with IGBTs in power supply inverter stages and for boosting the voltage in PFC stage. Vishay Portfolio • Vishay offers the industry’s broadest range of Ultrafast diodes in the market, ranging from 200 V to 1200 V • 150 ºC (HEXFRED®) and 175 ºC (FRED Pt®) maximum junction temperatures are available • Vishay technologies...

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