iX7059 Module Inspection Strong Performance for Highest Quality Demands As a result of their high degree of efficiency, powersemiconductors such as IGBTs are successfully used in electric drives as well as for the transmission of high voltages / DC voltages in the field of renewable energies. Manufacturers and end customers alike place requirements on efficiency, performance and safety, so flawless, durable functionality is the key to ensuring these requirements can be met in equal measure. The iX7059 Module Inspection 3D X-ray system offers seamless, reliable quality assurance in semiconductor production: The fully More Process Efficiency with 3D X-ray and Integrated CT automated 3D X-ray inspection with integrated computer tomography uses powerful radiographic technology to deliver exact inspection images of layers that are easy to classify. Its broad inspection scope extends to damaged, twisted, missing and incorrect components, THT solder joints, and concealed blow holes (voids) in surface soldering. The quality of each individual solder joint of Reliable inspection for complex and encased power components thanks to powerful X-rays the wired components determines whether overheating and consequently short circuits could occur due to a lack of heat dissipation, which must be avoided. Precise solder joint inspection on IGBT modules and SiC chips protects against overheating The compact X-ray system is designed for a space-saving inline setup and offers flawless handling of frame-based power modules Intelligent void check with measurement of the air inclusions for flawless heat dissipation or components on workpiece carriers. Thanks to the intelligent networking of the Viscom X-ray system within the production line, processes and quality are optimized over the long term – Rapid handling of workpiece carriers and soldering frames enabling highest throughput rates Solder joint inspection of chip layers exactly as required in a smart factory. Solder joint inspection of DCB layers DPAK with orthogonal radiation

*-------vision technology Technical Specifications Front view iX7059 Module Inspection X-ray technology X-ray tube Sealed microfocus X-ray tube High voltage 130 kV (up to 180 kV optional) Detector Flat panel detector type FPD T2 (FPD T3 optional), 14-bit grayscale depth 3D image capture mode Evolution 4 as standard, Evolution 5 optional for unique dynamic image recordings X-ray cabinet Designed to meet requirements for fully protected devices in accordance with the German Radiation Protection Act (StrlSchG) and the German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 pSv/h...