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High-End SPI System for In-Line Manufacturing

High-End SPI System for In-Line Manufacturing

High-End SPI System for In-Line Manufacturing

Product catalog summary
Overview: The iS6059 SPI is a high-end 3D Solder Paste Inspection (SPI) system designed for in-line manufacturing, offering advanced technology for inspecting solder and sinter paste. It features broad networking options through Viscom's Quality Uplink and provides color-assisted 3D solder paste volume calculation.
Key Features:
  • Inspection speed of 90 cm²/s with a field of view of 58 mm x 58 mm.
  • Orthogonal optical resolution of 12 μm with four angled views for shadow-free inspection.
  • FastFlow handling for extremely high throughput rates.
  • XM camera technology for precise defect detection and high inspection speed.
  • Evaluates 3D measurement data and links results for effective process control.
Technical Specifications:
  • Inspection scope includes solder paste deposits, sinter paste, adhesives, and more.
  • Camera technology: XM-SPI-II with 3D sensor technology.
  • Z-resolution of 0.1 µm and Z-range up to 5 mm.
  • System dimensions: 997 mm x 1756 mm x 1753 mm, weight approx. 1060 kg.
  • Power requirements: 400 V, 50 Hz, 3P/N/PE +/- 10%.
Software and Interfaces:
  • User interface: Viscom vVision/SI EasyPro.
  • Statistical process control: Viscom vSPC/SPC, open interface optional.
  • Remote diagnosis and programming station options available.
Global Presence: Viscom operates with a network of representatives and distributors across Europe, the Americas, Asia, and Africa, ensuring extensive support and service availability.
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Catalog excerpts

High-End SPI System for In-Line Manufacturing-1

High-End SPI System for In-Line Manufacturing Broad networking options via Viscom‘s Quality Uplink iS6059 SPI Excellent technology for solder and sinter paste inspection

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High-End SPI System for In-Line Manufacturing-2

FAST, VERSATILE, RELIABLE High-Throughput Paste Inspection with Maximum Accuracy Extremely high throughput due to FastFlow handling Enhanced quality and speed of inspection Four angled views for shadow-free inspection images Color-assisted 3D solder paste volume calculation High reproducibility Very easy operation: color images for verification and efficient program generation Customer hotline and website, remote maintenance The iS6059 SPI is a 3D SPI system that offers unbeatable advantages for economical SMT production. Key features include an Paste bridge after soldering inspection speed of...

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High-End SPI System for In-Line Manufacturing-3

FAST, VERSATILE, RELIABLE Side view Top view Inspection scope Camera technology XM-SPI-II

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High-End SPI System for In-Line Manufacturing-4

Shanghai Huizhou Headquarters: Viscom AG Carl-Buderus-Str. 9-15 30455 Hanover Germany Phone: +49 511 94996-0 Email: [email protected] Europe Viscom France S.A.R.L. 6, rue Saint Simon Zone du Vert Galant 95310 Saint-Ouen l'Aumone France Phone: +33 134 641616 Email: [email protected] Africa Viscom Tunisie S.A.R.L. Rahma Building; App B5, Block B, 2nd floor Lac Houran Street - Berges du Lac 1053 Tunis, Tunisia Phone: +216 71960584 Email: [email protected] Americas Viscom Inc. 1775 Breckinridge Parkway Suite 500, Duluth (Atlanta) GA 30096, USA Phone: +1 678 966-9835 Email: [email protected] Viscom Inc. 898...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.