Cutting-Edge 3D X-ray for Networked PCB Manufacturing
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Cutting-Edge 3D X-ray for Networked PCB Manufacturing Handling of large PCBs up to 1600 mm length possible iX7059 PCB Inspection (XL) Innovative X-ray inspection for maximum product quality and process efficiency

FAST, PRECISE, RELIABLE Pioneering Quality Assurance for Modern Electronics Manufacturing Complete defect detection on densely populated, thick and even double-sided PCBs Smooth handling of very large assemblies such as server boards, LED applications, semiconductors and 5G electronics High-precision solder joint inspection, even on extremely small Void in a THT solder joint components and the complex assemblies of high-performance processors Measurement of voids in surface soldering to ensure efficient heat dissipation Quality inspection on THT solder joints, pin height and degree of...

Best first pass yield results Viscom Quality Uplink provides maximum quality and process efficiency by means of intelligent networking of 3D SPI, 3D AOI, 3D AXI Closed loop Printer Quality Uplink Defect-free and stable high-end electronics manufacturing In addition to traditional SMD inspection, the iX7059 PCB Ensuring complete 3D X-ray inspection in the production Inspection (XL) also provides high-precision, reliable detec- line while at the same time meeting the highest cycle time tion of soldering defects such as head-in-pillow and pores requirements is a challenge that Viscom has long...

Technical Specifications Front view Side view iX7059 PCB Inspection X-ray technology X-ray tube Sealed microfocus X-ray tube High voltage Tube current Flat panel detector type FPD T2 (FPD T3 optional), 14-bit grayscale depth 3D image capture mode X-ray cabinet Evolution 4 as standard, Evolution 5 optional for unique dynamic image recordings Designed to meet requirements for fully protected devices in accordance with the German Radiation Protection Act (StrlSchG) and the German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h User interface Statistical process...