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CX700M (Single-Chip)

CX700M (Single-Chip)
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Unified Digital Media IGP * CX700M2 has Macrovision® support The VIA CX700M integrates premium graphics, audio, memory, storage, and HDTV support all in a single-chip design. This unified design enables the creation of smaller form factor designs, reduced power consumption, and easier cooling, all of which opens the door for an expanded range of embedded solutions. This is all done in a single-chip package exactly the same size as a North Bridge (37.5 mm x 37.5 mm) — representing a saving of over 34% in board real estate. This represents a major breakthrough for the embedded industry where ultra compactness is essential, and will have significant benefit for embedded boards such as PC/104 and VIA EPIA® mainboards. Complementing VIA's Nano™, C7® or Eden™ processor it supports, the VIA CX700M is based on a highly sophisticated power efficient architecture that enables such rich integration into a compact package with a maximum power envelope of just 3.5 watts. A number of key power management technologies are incorporated that monitor activity and dynamically control power according to system load requirements. Targeted for key embedded applications such as Point of Sales (POS) equipment, industrial PCs (IPC) and ultra compact, low power desktop systems such as thin clients, the VIA CX700M has been designed from the ground up to deliver excellent performance, features and power efficiency. The reduction in board space and operating power requirements together with the extensive multimedia, memory, connectivity and display flexibility provides embedded customers with the ideal chipset to take their ultra compact systems to the next stage. Key Features Host Interface VIA Nano™ / C7® / Eden™ processor (up to 800 MHz FSB) Memory Controller Two DDR / DDR2 DIMMs Supports 32 / 64-bit memory data width Supports ECC High Definition Audio Interface Up to 32-bit sample size at 192 kHz sampling rate Supports eight High Definition audio channels Supports High Definition modem Integrated 2D / 3D / Video Processor 128-bit 2D / 3D graphics engine 32 / 64 / 128 MB frame buffer sizes High Definition video processor and overlay engine Unified Video Decoding Processor MPEG-2 MP@HL video decoding acceleration WMV9 MP@ML video decoding acceleration Significantly reduces host processor utilization and system power consumption Video Capture Port Dual Transport Stream inputs or dual 8-bit or one 16-bit CCIR656/601 input Display Interface Three 10-bit 350 MHz RAMDACs for CRT and TV SDTV output mode (525p or 625p) HDTV support for 1080i and 720p Macrovision® support (CX700M2 only) LVDS / DVI interface in three configurations: LVDS: One Dual-channel or two Single-channels DVI: One Single-channel DVI + LVDS: One Single-channel DVI and one Single-channel LVDS DuoView+™ enables multi-monitor and extended desktop support using two independent display engines Storage Interface Supports up to two SATA (3 Gbps) devices Supports up to two EIDE devices Expansion Interface PCI bus with up to four master devices LPC bus for Super I/O extension One DVP interface for external TV encoder or DVI transmitter Peripheral Expansion Bus Six USB 2.0 / 1.1 ports Two RS-232 serial ports (optional) Power Management Dynamic clock gating control ACPI 2.0 and APM v1.2 compliant TDP Power TDP max: 3.5 W

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Video Inputs ■IDTV output LVDS/DVI panel Keyboard / Mouse * All product specifications are subject to change without notice. Update: February 20, 2012

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