Innovative Silicon & Metal Etch Solution The WaferEtch® Platform Lowest Cost of Ownership > High throughput > On-Board chemical mixing instead of expensive pre-mixed chemistry > Increased savings with up to 99.5% chemical recapture Excellent Process Control > Integrated silicon thickness measurement and Profile Match Technology™ > Improved fine-feature etch process control with instant quench > Arm movement compensation for radial wafer non-uniformities Efficient Chemical Management No Cross-Contamination > Multiple chemistries possible in a > The WaferEtch Collection Drain captures, single chamber recirculates, and isolates multiple chemistries > No same chamber. in the cross-contamination > Each chemistry is isolated with its own dispense

Veeco’s single wafer wet etch technology enables uniform selective etching on multiple process levels, free of cross-contamination. Etch uniformity better than 1% is routine. Whether for advanced packaging or BEOL Veeco’s single wafer wet etch technology enables uniform selective etching on multiple process levels, free wet etches, WaterEtch systems accomplish the highest yield process at the lowest manufacturing cost. of cross-contamination. films are needed in the active, routine. and/or for advanced packaging or BEOL When etch structures orEtch uniformity better than 1% isbackside,Whetherbevel...