Model RTP-100-HV Rapid Thermal Process Oven with Vacuum up to 4" (100 mm diameter) or 100 mm x 100 substrate size   For single wafer up to 100mm (4")  Ramp up rate up to 150 K/sec  SIMATIC© process control  7" touch panel -6  Vacuum up to 10 hPa  Process gas line with MFC for N2 Technical and design changes reserved Precise fast ramp up and fast ramp down rates Implantation/Contact Annealing Operation with inert gases, Oxygen, Hydrogen, Forming gas Excellent temperature uniformity Integrated data logging SiAu, SiAl, SiMo Alloying Heated by Infrared Lamps Low-k dielectrica 50 programs with 50 steps each Crystallization & densification Small foot print Si-Solar Wafer Cells on glass by Si-Wafer bonding UniTemp GmbH Luitpoldstr. 6 85276 Pfaffenhofen/Ilm

Rapid Thermal Annealing Process Oven with vacuum Programmable temperature profiles Record of process data Process in different gas atmospheres APPLICATION The RTP-100-HV Rapid Thermal Annealing System is an excellent tool for various semiconductor processes up to 100 mm diameter wafer size. The maximal achievable temperature is 1200 °C . Key features are precisely controlled fast ramp-up (150 K/sec) and excellent ramp-down rates (depend on temperature and loading) . PROCESS GASES Beside standard process gases, like Nitrogen, Oxygen, Forming Gas the system (depends on model) can also be used with...

Chamber material Quartz glass Chamber height Vacuum capability Up to 10-6 hPa (Turbomolecular pump included, excl. rough pump) Process chamber size Temp. unifomity Top and bottom heating with 18 IR Lamps (20 kW) Ramp down rate Flow Controller Mass Flow Controller (Nitrogen 5 nlm) (max. 4 pieces) SIMATIC© 50 programs with 50 steps each Water cooled Substrate Cooling Electrical connection UniTemp GmbH Luitpoldstr. 6 85276 Pfaffenhofen/Ilm [email protected] www.unite

Model RTP-100-HV OPTIONS RTP-H2 RTP-H2S RTP-MFC RTP-Ox RTP-MM RTP-SW RTP-TC RTP-VCR Hydrogen option with Safety device (Sensor and Hydrogen monitoring) Safety device for Hydrogen option (with cover and sensor) Additional process gas line with Mass Flow Controller (max. 3 add) * * = all in all max. 4 process gas lines Oxygen Analyser to measure Oxygen residues (not in combination with Hydrogen Option) Moisture Analyzer to measure moisture residues in the chamber Switchbox for chiller and vacuum pump add. Thermocouple to measure on device (plugged in chamber, max. 1) Tubing made of VCR (welded)...