RSO-650-200 and RSO-650-300 Reflow Solder Oven
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RSO-650-200 and RSO-650-300 Reflow Solder Oven
Product catalog summary
Overview: The UniTemp GmbH RSO-650 series is a reflow solder oven designed for high-temperature soldering processes up to 650°C, with vacuum capabilities and options for various process gases. It is suitable for laboratory and small-scale production applications.
Specifications:
- Models: RSO-650-200 and RSO-650-300
- Solder Area: 200x170mm (RSO-650-200), 319x309mm (RSO-650-300)
- Temperature Range: Up to 650°C
- Vacuum Capability: Up to 10-3 mbar
- Heating: 18 kW IR lamps
- Ramp Rates: Up to 75 K/sec for ramp-up, 200 K/min for ramp-down
- Interface: RS-232 with UniSoft software
- Dimensions: 555x460x520 mm
- Weight: 45 kg (RSO-650-200), 60 kg (RSO-650-300)
Features:
- Fluxless and void-free soldering
- Programmable temperature profiles with 20 program locations and 100 steps each
- Process data recording in .csv/.xls formats
- Small footprint suitable for tabletop use
Applications: The RSO-650 is ideal for fluxless soldering, flip-chip processes, adhesive bonding, hermetic sealing, solder bump reflowing, and more. It is used in prototype research, quality control, and environmental research.
Options and Accessories:
- Formic Acid Module for fluxless soldering
- Additional gas lines and flow meters
- Various trays and chamber inserts for different applications
- Vacuum measurement and data logging systems
- Closed-loop water cooling system
Certifications: The RTP series is certified by Curtis Straus according to CSA 22.2 No. 61010-1, UL 60601-1, UL/CSA 61010-2-10.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.