Model PTP-300 Plasma Temperature Process Oven max. part size 305 mm x 305 mm x 25 mm NEW!! Plasma Cleaning with parallel heating Applications: • Fast ramp up heating of substrates and wafers parallel with plasma cleaning • Special surface treatment for wafers or substrates • Fluxless soldering • Flip chip process • Adhesive bonding • Solder bump reflow • Soldering of power devices • Prototype development UniTemp GmbH Senefelder Straße 9 D-85276 Pfaffenhofen

The PTP-300 is the result of a cooperation between PINK GmbH Plasma-finish and UniTemp GmbH. Both companies combined their skills and experience in the field of rapid thermal heating processes and plasma cleaning with micro wave plasma. The unique combination unit PTP-300 is perfect for a lot of applications - either for combined cleaning/heating processes or only for solder reflow processes for maximum part size (loading area: 305 mm x 305 mm x 25 mm). When a gas is heated, its components get ionized when a certain temperature is reached. This state being reached is called a plasma. The components...

PTP Plasma Temperature Process Oven Technical Data PTP-300 Loading area Chamber height Chamber material for wafer/substrate size Vacuum connector Vacuum capability chamber Temperature range Heating Gas lines Interface Maintenance Process control Microwave generator Cooling Dimension outside Weight Voltage 305 mm x 305 mm x 25 mm 25 mm Aluminium (optional: Quartz glass chamber) max. 305 mm x 305 mm x 25 mm DN 25 KF flange up to 10-5 mbar (only with option PTP-HVP) up to 650 °C 24 IR Lamps (18 kW) 2 Mass Flow Controllers Ethernet Ethernet SPS Controller PP420 (B&R) with LCD display for plasma cleaning...