HPH-300 Hot chuck for 300mm wafer

Product catalog summary

Overview: The document provides technical specifications and features of the UniTemp GmbH Model HPH-300 hot chuck, designed for handling wafers up to 300mm with optional lift pins and vacuum hold capabilities.

Specifications:

Wafer Size: Supports up to 300mm (12") wafers.
Heated Area: 360mm diameter.
Temperature Range: Ambient to 250°C.
Temperature Distribution: At 100°C ± 0.5°C, at 200°C ± 1.5°C (without lift pins) or ± 2.5°C (with lift pins).
Power Supply: 230V/1600W.
Dimensions: Hot chuck - 330x3230x130mm; Controller - 220x220x125mm.
Weight: Hot chuck - 6 kg; Controller - 3 kg.

Features:

Controller: High precision Eurotherm PID controller (model 2416) with 0.1° resolution.
Programming: Allows storage of one program with 16 steps, including ramp up, lift pin up/down, and vacuum on/off.
Interface: RS-232 for easy programming via PC.
Lift Pins: Available in model HPH-300-L, includes 3 quartz lift pins for wafers from 3" to 12".
Vacuum Hold: Positioned in the middle of the chuck.

Applications: Suitable for semiconductor processing requiring precise temperature control and handling of large wafers.