Die Bonder PP5

Product catalog summary

Overview: The Die Bonder PP5 is a precision pick and place machine designed for handling and bonding dies with high accuracy. It features a model with a table on top and offers various options for enhanced functionality.

Specifications:

Accuracy: Up to 5 µm, with an optional flip accuracy of up to 1 µm.
Die Size: Minimum 200x200 µm, Maximum 50x50 mm.
Substrate Handling: Up to 150x500 mm, with vacuum or clamp holding.
Motorized Tables: X-axis 240 mm, Y-axis 90 mm, manual theta, joystick speed control, and 1 µm table resolution.

Alignment and Parameters:

Alignment: Manual with color CCD, digital target generator, optical zoom X12, direct placement, and auto-centering with two reference points.
Parameters: Programmable bond force (10g to 3000g), bond time (0 to 999 s), scrub in X and Y, selectable vacuum, and temperature (0° to 400° with eutectic option).

Features:

Adjustable work height, soft touch down speed, automatic pick-up and placement with controlled force.
Throughput is operator-dependent, up to 600 pieces per hour.
Vision system includes a color CCD camera with vertical viewing and optical zoom X12.
Display via TFT monitor and LED lighting.
Tool compatibility with diameter 3.17 mm and length 25 mm, with special tools available on request.

Options:

UV curing, eutectic control, heated work holder with gas control, hot gas, glue dispenser or stamping, customer work holder, binocular for inspection, flip, ultrasonic flip, PC controller interface, and frame.

Facilities:

Power: 110/230 VAC, < 500 watts.
Vacuum: 70%.
Forming Gas: N2.
Air: 70 psi.
Size and Weight: 680x640x700 mm, 130 lbs.

Eutectic Option:

Soldering under controlled atmosphere with a round work holder size of 50 mm.
Programmable temperature (0° to 400°), heating max +8° C/s, cooling, and three programmable temperatures (Idle, Eutectic, Release).
Adjustable height around 10 mm.

Catalog excerpts

Pick & Place Die BonderModel :PP5 with table on the top Accuracy :Up to 5 m:Up to 1 յm (option flip) Die size ::Minimum 200*200 m:Maximum 50*50 mm Substrathandled :Up to 150x500 mm:Parts holded by vacuum or clamp:Substrat, PackageՅ Motorized Tables :X 240 mm Y: 90 mm Manual theta. Speed by joystick. Table resolution1 m Alignment :Manual with color CCDDigital Target generatorOptical Zoom X12Direct placement2 references points for auto-centering placementIndexed Pick and Placement mode Parameters :On LCD screen Bond force: Programmable 10g up to 3 000 g Bond Time: Programmable 0 up to 999 s Scrub: X Y and number Vacuum Selectable on or off during bond Temperature: > Programmable 0հ up to 400(option eutectic) Work height adjustableSoft touch down speedAutomatic pick up with pick up force <10 gr.Automatic place with controled force.Throughput Pick and place: Operator dependent up 600p/h Vision :Colour CCD cameraVertical viewing Field of View . 2 mm to 20 mm Optical Zoom X12 (option flip field of view is fixed Ж1 mm or other..) Display :TFT monitor Light :LED light Tool :all tool with diameter 3.17 mm and length 25 mm, special on request. > -UV curing (see photo)-Eutectic, Digital control of ramp-up and down >

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-Heated work holder with gas control-Hot gas-Glue Dispenser or stamping-Customer work holder-Binocular for inspection -Flip-Ultrasonic Flip (with US digital system)-PC controller interface for automated cycles-Frame > PP5 flip on frame Power110/230 vac,< 500wattVacuum70%Forming gazN2Air70 psi, Size, footprint w*d*h:680x640x700mmWeight130 lbs Option eutectic with standart work holder (see photo) Soldering under controlled atmosphere Work holder round, size= 50 mm Coplanarity and theta adjustement Temperature programmable 0 up to 400а Heating max +8 C/s Cooling 3 temperatures ( Iddle, Eutectic...

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Die Bonder PP5

Die Bonder PP5

Catalog excerpts

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