Pick & Place Die BonderModel :PP5 with table on the top Accuracy :Up to 5 m:Up to 1 յm (option flip) Die size ::Minimum 200*200 m:Maximum 50*50 mm Substrathandled :Up to 150x500 mm:Parts holded by vacuum or clamp:Substrat, PackageՅ Motorized Tables :X 240 mm Y: 90 mm Manual theta. Speed by joystick. Table resolution1 m Alignment :Manual with color CCDDigital Target generatorOptical Zoom X12Direct placement2 references points for auto-centering placementIndexed Pick and Placement mode Parameters :On LCD screen Bond force: Programmable 10g up to 3 000 g Bond Time: Programmable 0 up to 999 s Scrub: X Y and number Vacuum Selectable on or off during bond Temperature: > Programmable 0հ up to 400(option eutectic) Work height adjustableSoft touch down speedAutomatic pick up with pick up force <10 gr.Automatic place with controled force.Throughput Pick and place: Operator dependent up 600p/h Vision :Colour CCD cameraVertical viewing Field of View . 2 mm to 20 mm Optical Zoom X12 (option flip field of view is fixed Ж1 mm or other..) Display :TFT monitor Light :LED light Tool :all tool with diameter 3.17 mm and length 25 mm, special on request. > -UV curing (see photo)-Eutectic, Digital control of ramp-up and down >

-Heated work holder with gas control-Hot gas-Glue Dispenser or stamping-Customer work holder-Binocular for inspection -Flip-Ultrasonic Flip (with US digital system)-PC controller interface for automated cycles-Frame > PP5 flip on frame Power110/230 vac,< 500wattVacuum70%Forming gazN2Air70 psi, Size, footprint w*d*h:680x640x700mmWeight130 lbs Option eutectic with standart work holder (see photo) Soldering under controlled atmosphere Work holder round, size= 50 mm Coplanarity and theta adjustement Temperature programmable 0 up to 400а Heating max +8 C/s Cooling 3 temperatures ( Iddle, Eutectic...