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Sputtering targets for semiconductor applications

Sputtering targets for semiconductor applications
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Sputtering targets for semiconductor applications - 1

Sputtering Targets for Semiconductor Applications Sputtering Targets for Microelectronics

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Umicore Thin Film Products Umicore Thin Film Products, a globally active business unit within the Umicore Group, is one of the leading producers of coating materials for physical vapor deposition with more than 50 years experience in this field. Its Semiconductors portfolio covers a wide range of highly effective sputtering targets and evaporation materials. Contents About Sputtering Targets for Semiconductors Sputtering Targets suitable for OC Oerlikon, Unaxis, and Balzers Sputtering Systems › ARQ151-6“, ARQ151-8“ › ARQ300 › AKQ515 Sputtering Targets suitable for Balzers Sputtering Systems...

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About Sputtering Targets for Semiconductors Semiconductors and electronics play a major role in our world. Just about everything from consumer goods, transportation, housing and manufacturing infrastructure, to large area information systems is based on such technologies. Umicore Thin Film Products (TFP) successfully develops, manufactures, sells and recycles high quality coating materials for thin film applications in the advanced packaging, compounds, microsystems, and silicon front end segments. Due to our longstanding experience and strong cooperation with OC Oerlikon (formerly...

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Sputtering Targets suitable for OC Oerlikon, Unaxis, and Balzers Sputtering Systems Part Number Copper Cu Chromium Cr Nickel Ni Tantalum Ta Titanium Ti Titanium Ti Tungsten W Part Number Aluminum Al Chromium Cr Copper Cu Molybdenum Mo Nickel Ni Tantalum Ta Titanium Ti Titanium Ti Tungsten W

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Description Symbol Purity Cooling Plate Form Part Number Aluminum Al 5N5 (99.9995%) 0483054 12 mm bonded on cooling plate 0483113 Copper Cu 4N5 (99.995%) 0483054 12 mm bonded on cooling plate 0483114 Chromium Cr 3N5 (99.95%) 0483054 12 mm bonded on cooling plate 0703532 Gold (9710 g) Au 4N (99.99%) 0483056 4 mm bonded on cooling plate 0483123 Nickel Ni 3N5 (99.95%) 0483054 7 mm bonded on cooling plate 0703707 Tantalum Ta 4N (99.99%) 0483056 4 mm bonded on cooling plate 0703063...

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Sputtering Targets suitable for OC Oerlikon, Unaxis, and Balzers Sputtering Systems Sputtering Targets AKQ515 Description Symbol Purity Form Suitable for cathode Mounting method Part Number

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Sputtering Targets suitable for Balzers Sputtering Systems Description Symbol Purity Form Cooling type Mounting method Part Number Ag, Au, Pd, Pt, SiO2 and other materials available on request. 08 |

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Sputtering Targets for Semiconductor Applications Mounting methods Backing plate Backing plate Backing plate

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Other targets in accordance with customers’ specifications are available on request.

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Please find your local sales partner at: www.thinfilmproducts.umicore.com Manufacturing sites of Umicore Thin Film Products Umicore JuBo Thin Film Products (Beijing) Co., Ltd. No. 5 Xingguang the 4th Street Tongzhou Park, Zhong Guan Cun Science Park, Tongzhou District Beijing 101111 P.R. China Tel +86 10 81508360 Fax +86 10 81508363 sales.materials.bj@ap.umicore.com www.thinfilmproducts.umicore.com Umicore Thin Film Products Taiwan Co., Ltd. No. 22, Aly. 4, Ln. 711, Bo'ai St., Zhubei City, Hsinchu County 302 Taiwan (R.O.C.) Tel +886 3553 2999 Fax +886 3553...

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