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ULVAC GmbH
Catalog excerpts
Backside Metallization Sputtering System SRH Series SRH Series (picture: SRH-530) is a production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application. Applicable substrate size: φ125 to 200mm. Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness. Up to 5 unique process recipes. Sputter-Etching process developed by ISM. Efficient water cooling mechanism by ESC method is available. Power devices WL-CSP (seed layer of electrolytic plating) UBM (Barrier metal) Geschäftsführer: Takaaki Yamaguchi, Mitsuru Motoyoshi · Sitz der Gesellschaft Garching · Registergericht München HRB 81 680 · VAT-ID: DE 129508184 Bankverbindungen: Bank of Tokyo-Mitsubishi, Düsseldorf (Code 300 107 00) 511-012534 · SWIFT BOTKDEDX, IBAN DE 60 3001 0700 00 000 12534 Hypo-Vereinsbank, Ismaning (BLZ
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