Backside Metallization Sputtering System SRH Series

Product catalog summary

Backside Metallization Sputtering System - SRH Series

Overview: The SRH Series, exemplified by the SRH-530 model, is a production system designed for the deposition of metallic films. It is particularly suited for applications in power devices, WL-CSP, UBM, and similar uses.

Features:

Supports substrate sizes ranging from φ125 to 200mm.
Capable of automatic transfer for ultra-thin silicon wafers with thicknesses up to 50μm.
Offers up to five unique process recipes.
Includes a sputter-etching process developed by ISM.
Features an efficient water cooling mechanism using the ESC method.

Applications:

Power devices
WL-CSP (seed layer of electrolytic plating)
UBM (Barrier metal)

Contact Information: ULVAC GmbH, Parkring 11, 85748 Garching, Germany. Phone: +49-89-96 09 09 0, Fax: +49-89-96 09 09 96, Email: [email protected]

Catalog excerpts

Backside Metallization Sputtering System SRH Series-1

Backside Metallization Sputtering System SRH Series SRH Series (picture: SRH-530) is a production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application. Applicable substrate size: φ125 to 200mm. Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness. Up to 5 unique process recipes. Sputter-Etching process developed by ISM. Efficient water cooling mechanism by ESC method is available. Power devices WL-CSP (seed layer of electrolytic plating) UBM (Barrier metal) Geschäftsführer: Takaaki Yamaguchi, Mitsuru Motoyoshi · Sitz der Gesellschaft Garching · Registergericht München HRB 81 680 · VAT-ID: DE 129508184 Bankverbindungen: Bank of Tokyo-Mitsubishi, Düsseldorf (Code 300 107 00) 511-012534 · SWIFT BOTKDEDX, IBAN DE 60 3001 0700 00 000 12534 Hypo-Vereinsbank, Ismaning (BLZ

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