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Product catalog summary

Overview: This document provides detailed specifications and applications for grinding, cutting, and polishing tools used in the manufacturing of electronic components. It emphasizes the importance of selecting the appropriate bond and grit size for various tasks to achieve optimal results.

Specifications: The document lists various specifications for grinding wheels and cutting blades, including dimensions, grit size, bond type, and application. For example, resinoid and metal bonds are specified for different grinding tasks, with dimensions provided for each tool type.

Grinding Tools: The document outlines different grinding wheel shapes and their applications, such as wafer manufacturing and ingot grinding. It highlights the importance of bond choice in achieving desired outcomes like profile retention and dimensional stability.

Cutting Tools: Specifications for diamond tools used in cutting ceramics, porcelain, and minerals are provided. The document details standard and macro cutting blades, including their dimensions and applications.

Applications: The tools are designed for specific applications in the electronics industry, such as chip making and wafer manufacturing. The document also mentions the use of mounted points for machining ceramic components.

Standards and Certifications: The document references ISO 9001:2000 and ISO 14001 certifications, indicating compliance with quality and environmental management standards.

Key Considerations: Emphasis is placed on the choice of bond and grit type to ensure optimal performance in grinding and cutting tasks. The document also notes the production of certain tools in clean rooms to maintain quality.

Catalog excerpts

ELECTRONIC GRINDING – CUTTING – POLISHING – TOOLS FOR ELECTRONICS-COMPONE

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Innovation Nano-Topology (Meter) Grit size (Micrometer) Capacity (Megabyte) As today’s innovations become tomorrow’s standards our customers are permanently facing new challenges. Via intensive R&D we deliver optimum solutions to complex problems. So choose TYROLIT for today and tomorrow. Choice of bond resinoid E ic e of b o n d C ho profile retention dimensional stability profiling character thermal resistance heat conductivity aging resistance vitrified metal The bond and core are decisive in obtaining the optimum use of the grain

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Cup-Wheel Grinding Plunge-Cut Grinding Edge Grinding Principle Grinding Wheel Clamping Fixture (Chuck)

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Single Side Grinding CSSG) SHAPE Note: SSG grinding wheels are produced in clean rooms and metal free; different dimensions on request

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Note: SSG grinding wheels are produced in clean rooms and metal free; different dimensions on request

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Cutting of Electronics-ComponentsStandard Cutting Blades Diamond tools for the cutting of: ceramics, porcelain, minerals etc ...

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Different dimensions on request! Removal of metal coating with TYROLIT - Elastic Wheels Type Different dimensions on request!

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TYROLIT SCHLEIFMITTELWERKE SWAROVSKI K.G. Swarovskistraße 33, A-6130 Schwaz/Austria Telephone +43/5242/606-0, Fax +43/5242/633 98 Internet: www.tyrolit.com

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All Tyrolit - Schleifmittelwerke Swarovski AG & Co K.G catalogs and technical brochures

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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