Sirus T2
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Table-Top Reactive Ion Etcher (RIE) The Sirus T2 RIE is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment. Applications Processes have been developed for etching silicon, silicon dioxide, silicon nitride, quartz, polyimide, tantalum, tungsten, titanium tungsten and other materials that require profile control, high selectivity and good uniformity. For a more detailed discussion of applications and processes, please visit our website at www.triontech.com. Standard Features o o o o o o Sirus T2 reactor with 200mm bottom electrode System controller (includes Pentium™ based computer and touch screen interface) Two mass flow controllers Automatic tuning with 13.56 MHz 600 watt RF generator Emergency Off system Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement) 12 month limited warranty Recirculating temperature controller Up to two additional mass flow controllers 170 l/s turbo 23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil The Sirus T2 system requires a roughing pump and either a chiller or cooling water with greater than 4 MΩ resistivity Stand not supplie

Table-Top Reactive Ion Etcher (RIE) WALL CLEANROOM CHAMBER 28.9 SIRUS T2 PLANVIEW LAYOUT Trion Technology (800)791-1504 or (727)461-1888 www.triontech.com