Plasma Etch & Deposition System The Oracle III is the smallest full production cluster system on the market. It consists of a central vacuum transport (CVT), vacuum cassette elevator and up to four process modules. These process modules are docked to the central loadlock and run in productionmode or can be operated independently as stand-alone systems. The Oracle III can be configured for either the lab environment (single wafer loading) or for full production (vacuum cassette elevators) making it the most flexible system on the market. Applications Because the Oracle III accommodates up to four separate process modules, there are many possible RIE/ICP etch and PECVD deposition process combinations. Multiple process modules can be run at the same time. Processes are safely run without atmospheric contamination since all chambers are vacuum loadlocked. The Oracle III comes with full process support both prior to and subsequent to purchase. For a more detailed discussion of applications and processes, please visit www.triontech.com. Cluster Tool Features Oracle III shown with 1 vacuum cassette elevator and 2 process modules Central Vacuum Transport Safe and contamination-free processing requires the process to be isolated from the surrounding environment. The way to do this is with a vacuum load-locked cluster consisting of a robotic arm, load-locked transfer cluster and reactor isolation valve. The central vacuum transport (CVT) comes with a direct drive, pick and place robot. Each CVT can accommodate up to 4 reaction chambers and up to 2 vacuum cassette elevators. Manual Loadlock The manual loadlock port allows the manual loading of a single wafer for R&D, pilot line or to run priority wafers. Vacuum Cassette Elevator The vacuum cassette elevator (VCE) allows high throughput, cassette-to-cassette capability for production applications. The Oracle III can have 1 or 2 VCEs plus a manual load port. Touch Screen A color flat panel display with touch screen interface provides the operator with full process Operator information at all times. The software guides the operator through each sequence in a logical Interface fashion and gives touch control of all process conditions. AC Distribution Module The AC distribution module automatically distributes predefined power quantities to the various internal components. When the Emergency Power Off button is tripped, the RF power is shut off and all valves involved with gas delivery are automatically closed and the machine automatically powers down to a safe standby mode. This system includes separate power controls for the main AC and peripherals. Process Module Features The cathode and anode are both machined out of single blocks of aluminum. After critical inspection they are hard anodized for protection from process chemistries. The bottom electrode is available in either 200mm or 300mm sizes and depending on electrode configuration, can process single wafers from 3” - 300mm. Process gases are introduced into the chamber either by an annular ring or a showerhead manifold.

Automatic Matching Network The uniquely designed matching network is built in as an integral part of the bottom electrode assembly to ensure accurate tuning, low transmission loss and virtually no RF radiation outside the network itself. The network uses a phase magnitude sensor and amplifiers to provide instantaneous feedback for quick precise tuning. RF Generator The system comes standard with a 600 watt, 13.56 MHz solid state RF generator. PC Process Controller The PC process controller provides simple and reliable system control. The graphical software package creates programs in block diagram...