MINILOCK-PHANTOM III Reactive Ion Etcher (RIE) with a Vacuum Loadlock
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MINILOCK-PHANTOM III Reactive Ion Etcher (RIE) with a Vacuum Loadlock - 1

Reactive Ion Etcher (RIE) with a Vacuum Loadlock The Minilock-Phantom III is the first plasma RIE system in the industry to incorporate a vacuum loadlock on a compact platform. The system meets all the safety and equipment needs for the most challenging etch processes including applications that require corrosive chemistries. Because metal and compound semiconductor etch processes use corrosive chemistries and are often sensitive to atmospheric moisture, consistent results as well as safety depend upon isolating the reaction chamber from the atmosphere. In addition, when operating at lower pressure, maintaining reproducible results from run to run is impacted when the chamber is exposed to the atmosphere between each run. The Minilock-Phantom III solves these issues with its fully integrated loadlocked delivery system. The Minilock-Phantom III comes with full process support both prior to and subsequent to purchase. For a more detailed discussion of applications and processes, please visit www.triontech.com. Tool Features Reactor The cathode and anode are each machined out of single blocks of aluminum. After critical inspection they are hard anodized for protection from process chemistries. The bottom electrode is available in either 200mm or 300mm sizes and depending on electrode configuration, can process single wafers or mounted parts (3" - 300mm). It also has multiple size batch capability (4x3"; 3x4"; 7x2"). Process gases are introduced into the chamber either by an annular ring or a showerhead manifold. Automatic The uniquely designed network is built in as an integral part of the bottom electrode Matching assembly to ensure accurate tuning, low transmission loss and virtually no RF radiation Network outside the network itself. The network uses a phase magnitude sensor and amplifiers to provide instantaneous feedback for quick precise tuning. Vacuum Trion's vacuum loadlocked system includes compatible robotic arm, reactor isolation valve and Loadlock locked chamber. The robotic arm has a direct drive pick and place mechanism that provides high reliability. RF Generator The system comes with a 600 watt, 13.56 MHz solid state RF generator. Touch Screen A color flat panel display with touch screen interface provides the operator with full process Operator information at all times. The software interface guides the operator through each sequence Interface in a logical fashion and gives fingertip control of all process parameters. PC Process The PC process controller provides simple and reliable system control. The graphical software Controller package creates programs in block diagram form. Process recipes are stored on the hard drive or can be stored on USB flash drives allowing each operator to maintain individual AC The AC distribution module automatically distributes predefined power quantities to the Distribution various internal components. When the Emergency Power Off button is tripped,the RF power Module is shut off and all valves involved with gas delivery are automatically closed and the machine powers down to a safe standby mode. This system includes separate power controls for the

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MINILOCK-PHANTOM III Reactive Ion Etcher (RIE) with a Vacuum Loadlock - 2

Automatic The system includes a butterfly pressure control valve operated directly by the process Pressure controller. This provides independent pressure control separate from all other process Control parameters. Gas State-of-the-art technology is utilized to ensure the utmost integrity and purity. Each Delivery reaction chamber accommodates up to eight mass flow controllers and all plumbing utilizes System surface mount, C-seal technology or orbital welded VCR fittings. Safety The system meets SEMI S2-93 safety requirements. The system is CE compliant with Machinery Directive 98/37/EC,...

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