Catalogs >
Toshiba America Electronics Components >
CMZ12 to CMZ51

CMZ12 to CMZ51
5Pages

Catalog excerpts

TOSHIBA Zener Diode Silicon Diffused Type • Average power dissipation : P = 2 W • Suitable for compact assembly due to small surface mount package “M-FLAT™” (Toshiba package name) Note 1: Ta = 30°C Device mounted on a ceramic board Board size : 50 mm x 50 mm Land Pattern size : 2 mm x 2 mm Board thickness : 0.64 mm Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Start of commercial production 2002-10

Open the catalog to page 1

Part No. (or abbreviation code) Abbreviation Code

Open the catalog to page 2

1) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. P : We recommend that the worst case power dissipation be no greater than 50% of the absolute maximum rating of power dissipation. Carry out adequate heat design. PRSM : We recommend that a device be used within the recommended area in the figure, PRSM-tw. Tj : Derate this rating when using a device in order to ensure high...

Open the catalog to page 3

Non-repetitive peak reverse Power dissipation PRSM (W) Maximum allowable temperature Ta max (°C) tW Ta = 25°C Rectangular pulse Recommended Power dissipation Pulse width Temperature coefficient of Zener voltage αT (mV/°C) Temperature coefficient of Zener voltage αT (mV/°C) (reference value) 1000 Device mounted on a ceramic board: board size : 50 mm × 50 mm Land Pattern size : 2.0 mm × 2.0 mm board thickness : 0.64 mm Zener voltage Transient thermal impedance rth (j-a) (°C/W) Device mounted on a glass-epoxy board: Board size : 50 mm × 50 mm Land Pattern size : 2.1 mm × 1.4 mm Board thickness...

Open the catalog to page 4

CMZ12 to CMZ51 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability,...

Open the catalog to page 5