Group: TOSHIBA
Catalog excerpts
Sales Sheet ASIC, Foundry & COT Solutions Highlights • Toshiba has more than 25 years of experience in ASIC design and has delivered over onehundred 90 nm designs in volume production over the last two years. • Toshiba is Japan’s largest semiconductor manufacturer and the 3rd largest worldwide.1 • Toshiba continues investment in its Electronic Devices business with a multibillion dollar Capex and R&D investment planned over the next several years. • Toshiba is a leading patent holder with 1,603 utility patents granted in the United States in 2008. (U.S. Patent Office) Advanced CMOS technology for ASIC, Foundry and COT businesses includes full service chain management. .. CUSTOMER BENEFITS Leading-edge CMOS technology through in-house process development • 65 nm LP in mass production • 40 nm LP libraries are available • 32/28 nm under development • 22 nm in research • Continuous expansion of System LSI wafer fabrication at multiple locations • RFCMOS technology, 0.13ì, 90 nm and 65 nm LP Customized System-on-Chip (SoC) development based on wide Intellectual Property (IP) line up • In-house analog cell development (mixed-signal IP) • In-house and 3rd party digital IP • Processor skills (ARM® and MIPS®) • Embedded memory (SRAM, eDRAM, eFLASH, OTP) Local competence and support – U.S. Design Centers • Highly skilled engineers with many years of chip design experience • Support of flexible service interfaces from Customer Owned Tooling (COT) to full ASIC • Development support – EDA/PDK • Mass production ramp-up (qualification and yield improvement) Short development Turn-Around-Time (TAT) to meet the market window ASIC, Foundry & COT Solutions 1 • Professional project management during development • Optimized manufacturing process • World-class learning curve in Defect Density Reduction for Advanced processes Flexible platform concept for SoC development • Re-synthesizable and fully customized UniversalArray™ for high flexibility and low risk Flexible business models for ASIC, Foundry and COT • ASIC: one partner for design, implementation, packaging and full service supply chain management. • COT: Reduce risk by choosing from Toshiba’s own IP library with access to Toshiba’s reliable infrastructure, mask making and die package solutions. • Foundry: Selective foundry services (wafer, chip-die, assembly, test). • A multitude of business models can be realized through Toshiba’s open and advanced Integrated Device Manufacturer (IDM) model. www.Toshiba.com/taec Technology Offering 65nm LP 40nm LP Low Voltage VDD 1.2V 1.1V Core Device HS Yes Yes LP Yes Yes LL Yes (ULL) Yes (LL) Core/IO Device VDD 1.8V 1.8V HS Yes Yes High Voltage VDD 1.8V 1.8V IO Device LP — Yes VDD 2.5V 2.5V LP Yes Yes VDD 3.3V 3.3V AL Yes — LP Yes Yes SRAM UDR Yes Yes UHD Yes Yes AL : Analog Device (Thick Oxide, Low Threshold UDR : Ultra Data Rate UHD : Ultra High Density Toshiba Technology Offerings
Open the catalog to page 1ASIC, Foundry & COT Solutions All trademarks are of their respective manufacturer and may be registered in certain jurisdictions. © Copyright 2/2009 TAEC Toshiba Shuttle Service Toshiba Metal Options www.Toshiba.com/taec Sales Sheet Toshiba is continuously working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba products, to observe standards of safety, and to avoid...
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