Analog & Imaging IC Logic LSI
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SEMICONDUCTOR & STORAGE PRODUCTS

Analog & Imaging IC / Logic LSI

CMOS Image Sensor Mobile Peripheral Device Power Management Motor Control Driver Text To Speech Middleware Smart Interface Digital Processing Sensing Input / Output Control Image & Video Processing Connectivity Wired : High Speed Serial Link Audio Processing Image Sensor (Camera) CMOS Image Sensor Memory/ Storage Interface Audio Input / Output Digital Processing ASIC Wired Connect Mobile Peripheral Device Interface & Bridges Motor Control Driver Sensing & Control Automotive Power Management Motor Control LED Drive Power Management Wireless Connect LED Driver Power Management LED Driver...

CMOS Image Sensor For high image quality , Toshiba has been developing BSI advanced technology (optimized process and design). And we have realized 1.12 μm pixel CMOS image sensor using this BSI technology and 65nm process. Fine pixel size (1.12μm) 65nm process BSI advanced technology Photo Diode Photo Diode High image quality • High sensitivity • Low noise High resolution High frame rate Low Z height of camera module FSI : Front Side Illumination BSI : Back Side Illumination Business Field Extensive Line up: VGA - 14M pixel , 3M - 12M pixel, Bright 1.75μm One Stop Solution ( Die/ CSP/...

Lineup Module Pixels Type Status Optical size Pixel size[µm] Pixel number Power supply Under Development Optical size Under Development Optical size Pixel size[µm] Pixel number Pixel size[µm] Full Frame rate Pixel number Power supply Frame rate Power supply

Mobile Peripheral Device OVERVIEW Toshiba MPD (Mobile Peripheral Device) is designed for extending interfaces of a host processor to connect various peripherals and external devices. Interface bridges, Display buffers, IOExpanders and memory interface devices are the lineup of MPDs. MPD enable users to use the latest peripheral on a system. System component Power management Display Buffer/Bridge Application Camera Bridge HDMITM Video Input SDXC / UHS-I Memory Controller INTERFACE BRIDGE Toshiba Interface bridge MPD supports various interface combination to connect different interfaces...

SDXC host controller with CPRM function SDIO Host TC358780XBG TOSHIBA SDXC Host Controller A high-capacity memory device is being required for supporting a high speed network and huge amount of information. And a new standard is necessary to support them. Toshiba SDXC host controller enables users to use the latest memory standard on a system. UHS-I UHS-I Roadmap (plan) SDXC up to 2TByte High speed read/write (UHS-I) CPRM support For Mobile Phone UHS-I SDXC USB3.0 CPRM/CPXM UHS-I SDXC USB2.0 CPRM/CPXM Feature 2 x UHS-I channels UHS-II SDXC CPRM/CPXM UHS-II/UFS SDXC USB3.0 CPRM/CPXM UHS-I...

Wireless Product Development Concept Feedback customer voices and latest wireless standard to new product development by engineers of skill in various wireless technologies such as Bluetooth, Wi-Fi, Digital Terrestrial Broadcasting Demodulator, RKE, and “FeliCa” IC Technology Wireless design capability System design technology for maximizing RF and Baseband total performance High interoperability quality including recovery design for abnormal protocol sequence RFCMOS design capability Very high receiving sensitivity for wide temperature range Cloud Layout design knowhow for reducing...

Mobile “FeliCa” System Function • Card emulation, Reader/Writer function support • Compliant with Mobile “FeliCa” • Data rate 212kbps/424kbps • Mobile “FeliCa” / Japan Railways Group (JR) certified Contactless Frontend • Built-in analog and Modulation/demodulation circuit compliant with “FeliCa” • Built-in Null point deletion system • Phase recovery circuit • Modulation and Switch circuit (SW1, SW2) • Control ports of external circuit for adjusting resonance frequency • HOST interface UART Secure Element • CPU ARM SC100TM (Secure Core) • “FeliCa” OS support • NV EEPROM with Error Correction...

MCU (32-Bit Microcontrollers) Toshiba has been expanding its portfolio of application-specific standard products (ASSPs) that combine an ARM CortexTM-M3 core, which features high performance, high code density and low power consumption, with a Toshibaoriginal NANO FLASHTM memory, which features high-speed programming and low power consumption. With Toshiba’s wide range of low-cost ARM CortexTM-M3 core-based ASSP offerings covering 8-bit to 32-bit, you can find the optimum solutions for your applications. Our product portfolio includes ASSPs specifically designed for digital TV, digital...

Product Groups with a 3-V Supply M330 Group Power-Saving modes CEC Controller Dedicated controller compliant with HDMITM 1.3a (CEC) Remote control signal preprocessor essential for digital consumer electronics Power-saving modes for 1.8-V operation High-speed on-chip oscillator Small package (6 x 6 mm TFBGA120) Application examples Application examples Digital TVs, projectors, Blu-rayTM recorders, AV systems, printers, home appliances, factory equipment, office equipment PLL/CG Debug WDT RTC PLL/CG Debug Power supply monitors, battery-operated devices, remote-controlled equipment, game...

ASICs To ensure competitiveness in the marketplace, one needs to produce more sophisticated, more technology-intensive and higher value-added products, using a process of technological innovation and systematic marketing. Toshiba’s application-specific integrated circuits (ASICs) will give you an edge beyond your expectations. You can select from gate arrays that feature short turnaround times; cell-based ICs that are suitable for increased system integration and aggressive performance goals; and embedded arrays and universal arrays that combine high-performance functions of cell-based ICs...

Lineup Product Lineup Toshiba’s ASIC offers gate arrays that feature short turnaround times; cell‐based ICs that are suitable for increased system integration and aggressive performance goals; and embedded arrays and universal arrays that combine high‐performance functions of cell‐based ICs with the gate array advantage of quick turnaround. You can choose an ASIC technology that best suits your schedule and design objective. While ASIC designs are becoming increasingly more complex, it is required to shorten their time‐to‐market. To ...