Top Seiko's Material Guide
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Metals with high melting point Tungsten (W) Atomic number: 74 　Properties Melting point (ºC) Thermal conductivity (W/(m・K)) Thermal expansion coefficient (×10⁻⁶) Specific gravity Hardness (Hv)　(GPa) Young's modulus (GPa) (the highest from all metals) (the lowest from all metals) (equal to gold) Application • Filaments for illumination, crucible; • Vacuum furnace for heaters as well as construction materials; • All kinds of electrodes for discharge lamps, electrical contacts; • Heat screen material, TIG welding electrodes; • Source components for semiconductor ions; • Sputtering targets; •...

Universal metal Silver (Ag) Atomic number: 47 　Properties Melting point (ºC) Thermal conductivity (W/(m・K)) Thermal expansion coefficient (×10⁻⁶) Specific gravity Hardness (Hv)　(GPa) Young's modulus (GPa) Application • Electric lines (low electric resistance); • Audio cables; • Wiring handling high frequency; • Tableware, jewels, dentist treatment; • Water purifiers (sterilization); Can be used as a compound metal ◇High heat conductivity, high electric conductivity Copper (Cu) Atomic number: 29 　Properties Melting point (ºC) Thermal conductivity (W/(m・K)) Thermal expansion coefficient...

Alumina (Aluminum oxide) Al2O 3 　Properties Melting point (ºC) Thermal Shock Resistance (ºC) Thermal conductivity (W/(m・K)) Thermal expansion coefficient (×10⁻⁶) Specific gravity Hardness (Hv)　(GPa) Application • Insulators, parts insulating electricity; • Furnace walls, furnace parts, jigs; • Nozzles, spinning tube; • Reaction crucible, reaction vessels; • Semiconductor-related parts; • Liquid crystal production parts; • Electron tube parts, pumps, grinding materials ◇High intensity, abrasion-resistant, heat-resistant, corrosion-resistant Aluminum nitride AlN 　Properties Melting point (ºC)...

Zirconia (Zirconium dioxide) ZrO2 　Properties Melting point (ºC) Thermal Shock Resistance (ºC) Thermal conductivity (W/(m・K)) Thermal expansion coefficient (×10⁻⁶) Specific gravity Hardness (Hv)　(GPa) Application • Industrial purposes cutlery; • Scissors, kitchen knife; • Gauges: pin gauge, block gauge, wrecking ball; • Various wear resistant parts ◇High tenacity, high intensity, abrasion-resistant Boron nitride BN 　Properties Melting point (ºC) Thermal Shock Resistance (ºC) Thermal conductivity (W/(m・K)) Thermal expansion coefficient (×10⁻⁶) Specific gravity Hardness (Hv)　(GPa) Application...

Metal Material Properties Table 1 ※Published data is for reference only Metals with high melting point Material symbol Component amount [%] Alloy (Mo-Cu) Heavy alloy Heavy metal (W-) FeNiCo (sintered) Sealing alloy (Kovar) Sealing alloy (Kovar) Density Hardness 1.30(1 type-HB) 1.60(2 type-HB) 2.00(3 type-HB) 2.30(4 type-HB) Yield strength Machining properties Flexural rigidity Young's modulus Poisson's ratio Boiling point Thermal properties Linear expansion coefficient For sealing hard glass Electronic components For sealing hard glass Electronic components Electrical Electric conductivity...

Metal Material Properties Table 2 ※Published data is for reference only Universal metals Material symbol Component amount [%] Stainless steel Density Hardness Tensile strength Machining properties Yield strength Flexural rigidity Young's modulus Poisson's ratio Recrystallization temperature Melting point Boiling point Linear expansion coefficient Thermal properties Thermal conductivity Specific heat Electrical Electric conductivity characteristic 20℃ Volume resistivity s Magnetic characteristic s [J/(kg･K)] [%I.A.C.S] [μΩ･cm] hydrochloric acid hydrochloric acid sulfuric acid Loss Loss Loss...

Ceramic Material Properties Table 1 Fine ceramics Main component amount [%] Silicon nitride Other component or binder Color General properties Aluminum nitride Silicon carbide Boron carbide SiC: Boron nitride Light yellow Milky white Dark grey Grey beige Water absorption Compressive strength Fracture toughness Young's modulus Poisson's ratio Flexural rigidity Machining properties Oxidizing atmosphere Thermal conductivity Thermal properties Thermal expansion coefficient Non‐oxidizing atmosphere Specific heat Dielectric strength Volume resistivity Electrical characteristics Dielectric...

Ceramic Material Properties Table 2 ※Published data is for reference only Main component amount [%] Fluorine phlogopite： Fluorine phlogopite: Other component or binder General properties Other materials Machinable ceramics Glass (fused quartz) Dark grey Compressive strength Fracture toughness Poisson's ratio Oxidizing atmosphere Non‐oxidizing atmosphere Young's modulus Thermal expansion coefficient Thermal properties Thermal conductivity 522(strain point) 562(transition point) 568(annealing point) Dielectric strength Dielectric constant Volume resistivity Specific heat Electrical...

Ceramic Material Properties Table 3 ※Published data is for reference only Ceramic compound material（MMC） Silicon carbide Silicon carbide Silicon carbide Silicon carbide Silicon carbide Silicon carbide Silicon carbide Silicon carbide Silicon carbide Silicon carbide based based based based based based based based based based Main component amount [%] Other component or binder Color Density Water absorption General properties Machining properties Compressive strength Fracture toughness Young's modulus Poisson's ratio Specific heat Thermal conductivity Thermal properties Thermal expansion...

Ceramic Material Properties Table 4 ※Published data is for reference only Ceramic compound material（MMC） Boron nitride based Other component or binder Color Boron nitride based Boron nitride based Boron nitride based Boron nitride based Boron nitride based Boron nitride based Boron nitride based Water absorption Light grey Flexural rigidity Machining properties Boron nitride based Main component amount [%] General properties Boron nitride based Compressive strength Poisson's ratio Young's modulus Fracture toughness Thermal expansion coefficient Oxidizing atmosphere Non‐oxidizing atmosphere...