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Metal bond notch wheel for semiconductor wafer

Metal bond notch wheel for semiconductor wafer

Product catalog summary
Issue: The demand for higher quality in the notch area of silicon wafers is increasing, necessitating the use of notch wheel abrasive grains with higher grain size numbers, such as #3000. This presents a challenge in extending the service life of these notch wheels.
Solution: To address the reduced lifespan associated with higher grain size numbers, improvements in the hardness and strength of the notch wheel bond are proposed. Additionally, the introduction of a proprietary dressing technology, AD-C, further enhances the service life. The company offers notch wheels compatible with various wafer types, including compound semiconductors, and is developing high-precision beveling and notch wheels for silicon wafers.
Product Specifications:
  • Grain size range: #400 - #3000
  • Outer diameter: Up to 4D (Minimum 2D)
  • Shank diameter tolerance: h6
  • Total length: Up to 35L
  • Deflection accuracy: ≥ 5 um at minimum
  • Groove shape tolerance: ≥ 1 degree at aperture angle
  • Number of grooves: Up to 5
Product Application: The notch wheel is designed for high-precision notch grinding of semiconductor wafers, featuring high swinging accuracy of the diamond part against the shank. Various specifications are available, including optimized groove shapes for sapphire wafers and wheels for mirror beveling.
Performance Comparison: A life comparison test indicates that the current product with AD-C dressing significantly outperforms conventional products with general dressing, particularly for #3000 grain size.
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Catalog excerpts

Metal bond notch wheel for semiconductor wafer-1

Notch wheel for semiconductor wafers Longer life of finishing notch wheels for silicon wafers [Issue] The demand for quality in the notch area of silicon wafers has been increasing year by year, and the notch wheel abrasive grains with a higher grain size number are increasingly being used. The challenge is to increase the service life of notch wheels that use abrasive grains with high grain size such as #3000. [Solution] Although the life of the notch wheel tends to become shorter due to the higher grain size number, the life can be enhanced by improving the hardness and strength of the notch wheel bond. In addition, the use of our original dressing technology AD-C allows for further improvement in service life. We can provide notch wheels that are compatible with various types of wafers, including compound semiconductors. We are also working on the development of high-precision beveling wheels and notch wheels for silicon wafers. Life comparison test with conventional product Comparison when the life of conventional product & general dressing is set to100 Conventional product & general dressing Compared with the conventional bond & stick general dressing, the new bond & unique dressing (AD-C) has achieved a significant improvement in life, especially for #3000. Current product & AD-C dressing Metal bond notch wheel for semiconductor wafers [Possible production range] Grain size : #400 - #3000 Outer diameter : Up to 4D (Min 2D) Shank diameter tolerance: h6 Total length : Up to 35L Deflection accuracy : ≧ 5 um @Min. Groove shape tolerance : ≧ 1 degrees @ aperture angle Number of grooves : Up to 5 grooves This wheel is used for the high-precision notch grinding of semiconductor wafers. Our original processing technology realizes high swinging accuracy of the diamond part against the shank. Wheels with various specifications, such as a wheel with optimized groove shape for sapphire wafers or a wheel for mirror beveling are also available. 2-3-5 Nakane Meguro-ku Tokyo 152-0031 Japan https://www.tokyodiamond.com/ E-mail: [email protected] Tel : +81-3-3723-8114 [2108GE05

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