Metal bond mounted diamond grinding wheel for chamfering glass
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Catalog excerpts

Mounted grinding wheel for glass Improved edge strength in cover glass chamfering for smartphones and other information terminals [Issue] Cover glass for smartphones and other devices, which are becoming thinner and lighter, needs to be chamfered to suppress micro-cracks and increase edge strength. [Solution] In the chamfering process of cover glass, switching from inexpensive electroplated wheels widely used today to our metal bond wheels, can improve the edge strength by suppressing micro-cracks. The chamfering by the metal bond wheel provides excellent roughness of the machined surface and nearly three times the end-face strength compared to chamfering by the electroplated wheel. In addition, the metal bond chamfering wheel realizes high-precision form grinding, improves machining efficiency, and has a long service life with sustained cutting performance. Comparison of end-face strength (the average of 4 point bending strength) after chamfering by electroplated wheel and metal bond wheel Processing condition Pressing speed : 8mm/min Grain size of the electroplated wheel : #800 Grain size of the metal bond wheel : #600 Metal bond mounted wheel for chamfering glass [Example of product specifications] Bond : “ME” or “123C” metal bond Grain size : #800 or #600 (for rough grinding) A high-precision formed wheel is necessary for efficient chamfering. Using our original machining technology, we are able to manufacture formed metal bond wheels that can realize high-precision forming of shapes. In addition, metal bond wheels are self-sharpening and have a durable cutting ability and long life. 2-3-5 Nakane Meguro-ku Tokyo 152-0031 Japan https://www.tokyodiamond.com/ E-mail: tds-en@tokyodiamond.com Tel : +81-3-3723-8114 [2108

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