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Metal bond diamond grinding wheel for difficult-to-cut material(cermet)

Metal bond diamond grinding wheel for difficult-to-cut material(cermet)
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Metal bond diamond grinding wheel for difficult-to-cut material(cermet) - 1

Grinding wheel for cermet Highly efficient machining is achieved by stable grinding even when the depth of cut in cermet machining is increased by a factor of five [Issue] We want to achieve even higher efficiency in cermet machining. It is necessary to be able to perform stable grinding even when the depth of cut is increased. [Solution] By controlling the self-sharpening action of the abrasive grains, the balance of quality, efficiency, and service life is optimized, resulting in stable grinding. We achieved five times the depth of cut of cermet grinding in a single pass (from 0.3 to 1.5 mm/pass). Even when the depth of cut is increased, the machined surface roughness and the size of chipping are suppressed, and the amount of wear, which is inversely proportional to the depth of cut, is maintained at the same level Max. size of chipping (left picture) at the test machining Processing condition Machine : CNC form grinding machine Work material : Cermet (TN250) Wheel spec. : 200D-10T-5X-76.2H * The target size of chipping : Under 10um “Metarex” Metal bond wheels for high-efficient grinding of difficult-to-cut materials These metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-tocut materials such as Al2O3-TiC and quartz. 2-3-5 Nakane Meguro-ku Tokyo 152-0031 Japan https://www.tokyodiamond.com/ E-mail: tds-en@tokyodiamond.com Tel : +81-3-3723-8114 [2108GE12

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