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Benefits of carbon fiber product for semiconductor

Benefits of carbon fiber product for semiconductor
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Benefits of carbon fiber product for semiconductor

Product catalog summary
Benefits of Carbon Fiber Reinforced Plastic (CFRP)
Light Weight: CFRP has a specific weight of 1.5, which is a quarter of the weight of iron, making it significantly lighter.
High Elastic Modulus: The tensile elastic modulus of CFRP ranges from 60 to 250 GPa, compared to SUS304 at 200 GPa and Aluminum (A5052-H34) at 70 GPa. The flexural modulus of CFRP ranges from 60 to 300 GPa, also surpassing SUS304 and Aluminum.
Vibration Damping: CFRP offers excellent vibration damping, making it ideal for use in transport arms and high-speed moving stages.
Thermal Expansion: CFRP can be designed to have zero thermal expansion.
Strengths of TIP Composite: Includes FEM analysis, non-destructive inspection, and natural frequency measurement.
Machining Technology: Although CFRP is a difficult-to-cut material, it can be processed with high accuracy. Specifications include flatness and parallelism of 2/100 and surface roughness of Ra1.6. High accuracy of adhesion with metal and high-level quality assurance are achieved with 3D measuring machines. Small quantity and wide variety production are available.
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Catalog excerpts

Benefits of carbon fiber product for semiconductor-1

Benefits of Carbon fiber reinforced plastic(CFRP) Light weight Specific weight of CFRP is 1.5 and ¼ of the iron weight. High elastic modulus Tensile elastic modulus CFRP: 60-250Gpa, SUS304: 200Gpa, Aluminum (A5052-H34): 70Gpa Flexural modulus CFRP: 60-300Gpa, SUS304: 200Gpa, Aluminum (A5052-H34): 70Gpa Vibration damping Excellent vibration damping compared to metal, and works predominantly on transport arms and high-speed moving stages. Thermal expansion Zero expansion can be possible by design.

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Benefits of carbon fiber product for semiconductor-2

Strengths of TIP composite FEM analysis Non-destructive inspection, natural frequency measurement and etc. Machining technology CFRP material "difficult-to-cut material," but can be processed with high accuracy. Flatness: 2/100 Parallelism: 2/100 Surface roughness: Ra1.6 ・ High accuracy of adhesion with metal etc. ・ High-level of quality assurance with our 3D measuring machines. ・ Small quantity and wide variety of production can be availab

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.