TESCAN S9000X
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TrigLav™ UHRSEM Low-kV ResoLution Signal-Selective Detection

Ultimate resolution and maximum throughput in large-scale sample preparation and characterisation TESCAN S9000X is the platform for the most challenging physical failure analysis applications in semiconductors and material characterisation that require ultimate precision and extremely high-throughput. The TESCAN S9000X guarantees ultimate resolution and surface sensitivity essential to resolve nanosized structures, provides best conditions for large-volume 3D sample characterisations, and at the same time, it delivers unmatched FIB capabilities that enable precise, damage-free, and...

ĬĬ Fast microanalysis without sacrificing spatial resolution. The Triglav™ SEM column features a new Schottky FE gun that enables beam currents up to 400 nA and rapid beam energy changes. Real-time In-Flight Beam Tracing™ for performance and beam optimisation includes direct and continual control of beam spot size and beam currents guarantees best conditions for microanalysis. ĬĬ Large wafer analysis Thanks to optimal 60° objective geometry design and a large chamber that allows both SEM and FIB analysis of 6” and 8” wafers at any location. ĬĬ Complex applications easier than ever New...

TESCAN Xe Plasma FIB: combining power and precision in one single instrument Xe plasma FIB has positioned as a powerful microanalytical technique that has completely changed the landscape and scope of FIB applications in science but also and mainly industry. What makes Xe plasma special is that it is possible to achieve very high ion beam currents up to 2 µA without compromising beam quality, a feature which makes the TESCAN S9000X a suitable technique for large-volume milling tasks and the ideal choice to increase throughput and productivity in routine workflows in fabs and semiconductor...

Applications Root-cause physical failure analysis of today’s semiconductors devices has become an extremely complex task that needs to deal with ever smaller devices with higher density and functionality. This requires of highly-reliable analytical platforms that can keep up with the increasing complexity of design and architectures of integrated circuits, optoelectronic devices and in general, with the development of new nanotechnologies and nanomaterials. The TESCAN S9000X is a powerful FIB-SEM platform specifically designed to take up such challenges. The ultimate resolution, surface...

Electron optics: *With the Beam Deceleration Technology option (BDT), and SE(BDM) detector TESCAN ORSAY HOLDING reserves the right to change the document without notice. 2018.07.27