TESCAN S8000
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Btescan PERFORMANCE IN NANOSPACE TESCAN S8000 New generation of SEM microscope

TESCAN S8000 Ultra-high resolution and best conditions for microanalysis guaranteed in one single instrument The TESCAN S8000 is a Scanning Electron Microscope beam currents and first-class imaging performance (SEM) that comes to satisfy the most demanding with outstanding contrast at low beam energies. The needs for image quality and sample microanalysis new TESCAN Essence™ software platform is the key that routinely arise in different fields of research and component which makes the TESCAN S8000 an easy- technology. Researchers can now benefit from all the to-use microscope; excellent...

TESCAN BrightBeam™ SEM column technology The electron optics in the new TESCAN BrightBeam™ SEM column technology is based on a combined electrostatic-magnetic objective. A potential tube through the whole column keeps electrons at an energy that is higher than the electron beam landing energy, and as a result, electrostatic interactions within the beam are reduced which in turn, reduces significantly optical aberrations specially at low beam energies. In addition, the potential tube makes the electron beam less susceptible to environmental (stray) magnetic fields. These features result in...

When it comes to versatility, the TESCAN S8000 microscope delivers a truly flexible analytical platform that offers excellent quality in imaging with superb contrast. Whether your samples are conductive or nonconductive, magnetic or nonmagnetic, organic or inorganic, the TESCAN S8000 offers the ideal imaging conditions thanks to its advanced detection system with electron-signal filtering capabilities and variable pressure operations. Fig: TESCAN Essence™ -- simplified GUI and customisable. New TESCAN Essence software platform makes microscope control easier than ever ĬĬSimplified UI with...

Applications It is the excellent performance at low beam energies which makes the TESCAN S8000 ideal for characterisation of nanomaterials, rigorous quality control in the high-end manufacturing industries or routine inspection and fault isolation tasks for the purposes of failure analysis of microelectronic devices in semiconductor foundries. Failure Analysis in the Semiconductor Industry Fig.: SEM image at 700 eV of an IC delayered to the transistor contact layer. Topography contrast provided by the E-T detector reveals that M1 layer is not fully removed and delayering is not completed....

*With the optional Beam Deceleration Technology (BDT)