LYRA3 is a dual beam system that combines a high-resolution FE-SEM column with a versatile high-performance Ga ion source FIB. LYRA3 is an excellent choice for preparing cross-sections, site-specific high-quality TEM lamellae and, high-resolution FIB-SEM tomography for 3D sample reconstructions. Users can profit from the excellent resolution at high beam currents which has proved to be advantageous for analytical applications such as EDX, WDX and EBSD. LYRA3 satisfies the nowadays needs for sample characterisation and microanalysis in materials science and industry. In addition, beam / ion lithography...

User-Friendly Software Multi-user environment localized in many languages. Image management and report creation Built-in self-diagnostics for system readiness checks Network operations and remote access/diagnostics Software Tools 䀀Modular software architecture enables several extensions to be attached. Basic set of software modules, such as highly automated ion beam control; DrawBeam Basic pattern generator; simultaneous FIB/SEM imaging; predefined FIB working profiles available as standard Several optional modules and dedicated applications optimized for automatic sample examination procedures,...

Common FIB-SEM Applications 4a Materials Science Materials characterization of metals, ceramics, polymers, composites, coatings, metallurgy, metallography, fracture analysis, degradation processes, morphological analysis, steel cleanliness analysis, microanalysis, texture analysis, ferromagnetic materials, etc. using automated 3D EBSD analysis, 3D reconstruction and visualization, TEM lamellas preparation. Fig. 4: FIB cross section of nano-structured solar cell. Same image using EBIC detector signal (a) and Research Mineralogy, geology, paleontology, archeology, chemistry, environmental studies,...

Applications in forensic sciences The combination of FIB and SEM makes for one of the most versatile instruments available for the examination and analysis of the micro and nano characteristics of solid objects. The main advantage of this state-ofthe-art technique is the capability to analyze defects, microstructure, phases or interfaces in a specific region of interest. The preparation of samples for other analytical techniques is another important application for the semiconductor or storage media industry as well as in materials research. The preparation of lamella for transmission electron...

Applications in materials science The development of new materials requires precise knowledge of their structure and its relationship to mechanical behavior. These FIBSEM systems enable high-resolution studies of a material’s structure, the preparation of FIB cross-sections at selected positions for sub-surface investigations, or the preparation of TEM lamellae. Oriented TEM Lamella Preparation The preparation of TEM lamellae by FIB is fast and more accurate than other available techniques. Being able to select the exact position and orientation of the lamella is one of the unique capabilities...

Applications in nanotechnology and semiconductors Ion Beam Lithography and Prototyping Spintronic structures are typically prepared by sputter deposition of layered structures, consisting of magnetic and non-magnetic metallic or dielectric thin films, with thicknesses typically in the range of 5–50 nm. They can be patterned by FIB lithography into wires, disks, rectangles or pillars with lateral dimensions varying from under 100 nanometres to several microns. These structures are then used for studies of domain wall motion in magnetic nanowires, spintransfer-torque studies in nanopillars and...

3D TOMOGRAPHY The FIB’s ability to prepare nano-precise cross sections opens up the possibility of sub-surface analysis. Automated sequential sectioning turns the two-dimensional analysis into a 3D volume characterisation, see Fig. 15. This emerging technique gives a better understanding of the volume distribution, 3D structure and the relationship between three-dimensional objects in the specimen. Fig. 15: Direct volume rendering visualization is less sensitive to noise. A semi-transparent colormap can be applied to highlight different objects. Intuitive Software module TESCAN delivers an advanced...

LYRA3 FIB-SEM configurations LYRA3 can be equipped with a gas injection system (GIS) which is an essential component for most of all FIB applications as it delivers the gas chemistry needed for depositing Pt protective layers for cross-sectioning and lamellae preparation, Pt, W and SiO2 depositions for circuit edit, XeF2 for enhanced milling rates in Si, and, it also makes it possible gas-assisted delayering. LYRA3 can also be equipped with nanomanipulators, and a wide variety of detectors to comply with the most diverse range of applications in all fields of research in both science and industry....

LYRA3 - Technical specifications Electron Optics Electron Gun High Brightness Schottky Emitter Resolution in high-vacuum mode SE Beam Deceleration (option) STEM (option) Resolution in low-vacuum mode SE LVSTD (option) Electron optics working modes High-vacuum mode Resolution, Depth, Field, Wide Field, Channelling Low-vacuum mode Resolution, Depth Electron Beam Energy: 200 eV to 30 keV / down to 50 eV with BDT option Probe current Canion / Cobra Ga Liquid Metal Ion Source Accelerating Voltage Probe Current < 5 nm at 30 keV / < 2.5 nm at 30 keV (at SEM-FIB coincidence point) Minimum 150 × at coincidence...

Power: 230 V ± 10 % / 50 Hz (or 120 V / 60 Hz - optional), 2300 VA No water cooling Compressed dry nitrogen for venting: 150 - 500 kPa Compressed air: 600 - 800 kPa Environmental requirements Environment Temperature: Relative humidity: Acoustic noise: Active vibration isolation: Background magnetic field: Room for installation: 17 - 24 °C with stability better than 2 °C with the rate of change 1°C/hour (0.017°C/min) < 65 % < 60 dBC < 10 pm/s below 30 Hz < 20 pm/s above 30 Hz synchronous < 300 nT asynchronous < 100 nT 4 m x 3.5 m minimum minimum door width 1.0 m Altitude: max. 3000 m above sea...