SMT-II
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SMT-II “LOW STATIC” BOARD CLEANER

“LOW STATIC" BOARD CLEANER SMT-II by Teknek creates a new benchmark in SMT board cleaning. With Low Static Cleaning and Low Applied Pressure SMT-II creates the perfect method for removing contamination before solder paste print. Industry demands for increased traceability and integration have been addressed, SMT-II comes with IPC Hermes as standard. teknek SPECIFICATION CLEANING WIDTHS An ITW Company PRODUCT COMPLIANCE Polarity Wrong part 4% Lifted Leads 4% Printing Process Related Defects www.teknek.com Manufacturer reserves the right to change the machine specification without notice.

Every part of SMT-II has been designed to clean boards within a low static environment. This is achieved through careful design along with patented elastomer and adhesive technology ① NT™ Rollers Ground Pathways Communication between equipment within the SMT process has never been more important, not only will the SMT-II fully integrate into the process but will also come as standard with IPC-Hermes-9852 or SMEMA capability. With a new simple to use graphics user interface, SMT-II is easy to set up and run. Interface Low Applied Pressure As technology drives the need for thinner and more...

“LOW STATIC” BOARD CLEANER TECHNICAL SPECIFICATION teknek An ITW Company MACHINE WIDTH WORLD LEADER IN CONTACT CLEANING SM Teknek Head Office River Drive Inchinnan Business Park Renfrewshire, PA4 9RT Scotland, UK T: +44 (0)141 568 8100 E: teknek@teknek.com Teknek China Ltd Unit E, 4/F, Winfield Industrial Building, 3 Kin Kwan Street, Tuen Mun, N.T. Hong Kong T: +852 2468 3160 E: hk@teknek.com ® Teknek (BRUX Japan) 1-3-1-6F Hakataekiminami Hakata-ku, Fukuoka-city, 812-0016 Japan T: +81(0)92 473 6455 E: teknekjapan@brux.jp M—: Teknek (Simco-Ion) 2 257 North Penn Road Hatfield, PA 19440 USA T:...