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The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT)

The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT)

The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT)

Product catalog summary
Description
The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT) is an essential solution for integrating Photonics Integrated Circuits (PIC) with fiber optics, designed for low-footprint and low-profile optical injection into grating couplers. It is ideal for PIC packaging and wafer-level testing. TEEM's ioNext platform offers a variety of TC-WAFT products, both bare and pigtailed, customizable in terms of port number, output pitch, and output mode size.
Key Features
  • Number of ports: Options available for <32, 32-96, and 96-256.
  • Max Insertion Loss: 0.7 dB for <32 ports, 0.9 dB for 32-96 ports, and 1.1 dB for 96-256 ports.
  • Insertion Loss Uniformity: Less than 0.2 dB for <32 ports and less than 0.3 dB for 32-256 ports.
  • Max Polarization Dependent Loss: 0.1 dB for <32 ports and 0.2 dB for 32-256 ports.
  • Max Adjacent Crosstalk: -30 dB for <96 ports and -25 dB for 96-256 ports.
  • Output Mode Size at 1550nm: 10 µm @ 1/e².
  • Minimum Output Pitch: 20 µm.
  • Outputs Positioning Relative Accuracy: +/- 0.05 µm for <32 ports and +/- 0.1 µm for 32-256 ports.
  • Polarization Extinction Ratio: Greater than 25 dB.
  • Operating Wavelength: 1200 - 1700 nm.
Options
  • Fibre Connection: Available with SM or PM fibres and connectors such as FC, SC, ST, LC, or MPO.
  • Custom Chip Designs: Options for variable output pitches and additional optical functions like taps and splitters.
  • Custom Chip Dimensions and Shaping.
Applications
  • PIC packaging with grating couplers.
  • Wafer-level testing with edge couplers.
See more

Catalog excerpts

The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT)-1

DESCRIPTION The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT) is the must-have PIC-to-fiber solution for a low-footprint, low-profile optical injection into grating couplers. It is perfectly suitable for PIC packaging and wafer-level testing. Thanks to its ioNext platform (Photonics Integrated Circuits on glass), TEEM offers a whole range of bare and pigtailed TC-WAFT products, with user-defined port number, output pitch and output mode size. KEY FEATURES Number of ports Max Insertion Loss * (dB) Insertion Loss Uniformity * (dB) Max Polarization Dependent Loss (dB) Max Adjacent Crosstalk (dB) Output Mode Size @1550nm (µm @ 1/e²) Minimum Output Pitch (µm) Outputs Positioning Relative Accuracy (µm) Polarization Extinction Ratio (dB) Operating wavelength (nm) OPTIONS  Fibre connection - SM or PM fibres - FC, SC, ST, LC or MPO connectors  Custom chip designs : - Variable output pitches - Additional optical functions (taps, splitters…)  Custom chip dimensions

 Open the catalog to page 1
The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT)-2

APPLICATIONS PIC packaging (grating coupler) STANDARD TC-WAFT SHAPE SHAPING OPTIONS Wafer-level testing (edge coupler)

 Open the catalog to page 2
The Top-Coupling Waveguide Array to Fiber Transposer (TC-WAFT)-3

PART NUMBER DESCRIPTION

 Open the catalog to page 3
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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