Overview of TEP Series Panel Computing Devices

The TEP series offers a range of off-the-shelf industrial panel computers with integrated networking and flexible power options including 12V DC, 24V DC, 8-36V DC wide power, and Power over Ethernet (PoE). These devices support ARM and x86 architectures and come in IP65-rated anodized aluminum enclosures, allowing for water cleaning and enhanced durability. The design emphasizes robustness with cable-less construction and high-speed board-to-board connectors for expansion.

Customization and Expansion

Customers benefit from in-house design and customization services to tailor solutions to specific project requirements and budgets. Expansion is facilitated through power, networking, and I/O modules, with board-to-board connectors ensuring reliable operation in high-friction environments. Internal mini-PCIe sockets and M.2 slots support SSDs and wireless modules (3G, LTE, Wi-Fi) for cloud or remote network connectivity.

Operating System Support and Software

TEP devices come with source code and binary demo images for multiple operating systems, including Android, Yocto Linux, Ubuntu, and Windows (x86 models). Full source code, u-boot, and support packages are provided to facilitate development and customization.

I/O Expansion Modules

The I/O expansion modules offer interfaces such as CAN Bus, UART, I2C, SPI, USB, and GPIO. Options include galvanic isolated models supporting RS-232/422/485 serial ports and non-isolated versions. These modules support complex customer requirements and have been used in thousands of projects ranging from minor modifications to fully custom designs.

Model Specifications Summary

• Display Sizes: 5", 7", 10.1", and 15.6" with resolutions from 800x480 to 1366x768 pixels and luminance between 300-350 cd/m².
• Processors: ARM Cortex-A7, Cortex-A9, NXP i.MX6/i.MX7 series, and Intel x86 Braswell (Atom x5-E8000, Pentium N3710).
• Memory: Up to 8GB DDR3L SO-DIMM on x86 models; up to 2GB DDR3L on ARM models.
• Storage: eMMC standard; optional M.2 SSD and SATA support.
• Networking: Dual or single Gigabit LAN ports (Atheros AR8035, Intel i210), Wi-Fi, 3G/LTE via mini-PCIe and SIM slots.
• USB Ports: Multiple USB 2.0 and USB 3.0 hosts and OTG (Type-C) ports depending on model.
• Expansion Interfaces: CAN Bus (FlexCAN 2.0B), RS-232 serial ports, GPIO, boot select/reset buttons, programmable LEDs, microSD and SIM card slots.
• Power Inputs: 12V, 24V, 8-36V DC wide range, and PoE options.
• Certifications: CE, FCC, RoHS, REACH compliant.

Power and Networking Expansion Modules

Power modules support various DC inputs and PoE (802.3at). Networking modules provide RJ45 LAN connectors compatible with the main devices. These modules enable flexible deployment in diverse industrial environments.

Key Features and Benefits

• Robust IP65-rated aluminum enclosure suitable for harsh environments.
• Cable-less design enhances reliability and ease of maintenance.
• Wide range of display sizes and resolutions to fit different application needs.
• Comprehensive OS support with open-source software and development tools.
• Extensive expansion capabilities for I/O, networking, and storage.
• Customization services to meet complex and unique project requirements.
• Long product lifecycle management and technical support from TechNexion.

Contact and Manufacturer Information

TechNexion Ltd.
16F-5, No. 736, Zhongzheng Rd., Zhonghe Dist., New Taipei City, 23511, Taiwan.
Tel: +886-2-8227 3585
Fax: +886-2-8227 3590
Email: [email protected]
Website: https://www.technexion.com