Main Features • The PICO-IMX7 design based on the NXP i.MX7 multi-market applications processor is designed to enable secure and portable applications within the Internet of Things. • Pin-compatible with the Intel Edison for sensors and low-speed I/O, but also adds additional expansion possibilities for multimedia and connectivity, that can easily be expanded and implemented for IoT designs. • Wi-Fi and Bluetooth communication interface. yocto PROJECT Specifications Core System Processor Architecture PMIC Memory Storage Board-to-Board Connector System on Module Connectivity Network LAN Wi-Fi/Bluetooth Antenna NXP i.MX7 Solo NXP i.MX7 Dual ARM Cortex-A7 + M4 NXP PF3000 up to 2GB DDR3L eMMC (4GB Default) MicroSD Cardslot (optional) Edison compatibile connector PICO 70-pin Hirose connectors PICO System on Module RGMII Qualcomm QCA9377 802.11 a/b/g/n/ac + BT 5 (BR+EDR+BLE) MHF4 connector (optional) Video Graphic Engine Camera Audio Audio Codec Audio Interface Image re-sizing / rotation / overlay and CSC Pixel Processing Pipeline MIPI CSI (2 lanes) On carrier board I2S (2 channel) Power Specifications Power Input Power Consumption Operation Systems Standard Support Extended Support 4.2-5.25V DC Depending on Configuration Android Things Linux Yocto Ubuntu Android Commercial Linux TechNexion PICO System-on-Modules

Block Diagram Wi-Fi / Bluetooth (optional) NXP i.MX7 Solo / Dual Edison Signals Environmental and Mechanical Order Information Example: Dimensions Form Factor Weight Temperature Relative Humidity MTBF Shock Vibration Certification 37 x 40 mm / 1% x 1% inch PICO Compute Module 8 grams Commercial: 0° to +60° C Extended: -20° to +70° C 10 to 90 % >100 000 Hours 50G/25ms 20G/0-600Hz Compliant with CE / FCC / RoHS / REACH directives * Feel free to contact us for customization requests. 2019-04-15. All specifications are subject to change without notice. PICO System-on-Modules